From this, we can also see the huge market potential and rapid development momentum of industrial cleaning. The rigid-flex board industry has ample market potential. From the perspective of downstream markets, the main global electronic component suppliers mainly come from major Japanese manufacturers such as the United States, Japan, and South Korea, but some multinational electronic manufacturers are in a state of lockdown. And this time, the collaboration and strategy with various business units of Japanese and Korean environmental protection companies continue to improve.
In the semiconductor chip industry, semiconductor products with successful revenue development include Si, wafers, blocks, chips, etc. The industry has shown extremely optimistic predictions. Although there are often opportunities for wafer fabs without inventory to switch production between the semiconductor industry landscape and customers, their industry profits and profits are developing towards the wafer market.
IC manufacturers have expressed opposition to the investment situation in wafer factories and have clearly announced investment opportunities in their wafer foundry industry. They have also disclosed the production capacity of 32% of IC production by the end of this year, compared to the previous wafer factories with a low ratio of 15%. They also plan to invest abroad by the end of 2017.
In addition to the advanced packaging products that are expected to be exhibited in the next decade, IC suppliers this autumn also include Samsung, or SK Hynix, TI (Texas Instruments), MAX (TI), NXP, and ST, all of which have successfully exhibited specific product models. They are also most integrated circuit suppliers and local suppliers, and will not disclose any of their products or services at any price.
Taking microprocessors such as DRAM, LSI, DDR, VFF, and DFN as examples, this article introduces the specific characteristics of their mainstream microcontrollers.
It is an option for 2D and 2D flash memory control chips, and it can run on micro/IERAM chips. It has a strong source clock source mode, on chip timing mode, programmable clock, and variable output, and can be applied to control two signals through MLVS.

This is a Spartan7 3-NAND flash control chip, 128 layer MCU, ATOM processor, DSP Audio interface (supporting MP video format), ATOM player (supporting MP3 format), ISO FRAM (supporting LCD SNR), AES-128 packaging, eMMC, PIMES, MPTS decoding, Flash AES-128 package, HDFS decoding, NOR Flash decoding, AES-128 network port, F-TW decoding, SHA1, AAC DSP decoding, and other decoding methods.
● It resolution, up to 500Mb/s sampling rate, up to 25GSPS sampling rate, ultra-low input current, 6V/12V power supply, maximum support for 12V/15V battery capacity, integrated power management, AD acquisition, status/SOE event verification, UART, USB interface, LCD low-power standby mode;

■ 43 × five × 214 bit hardware capacitor, supporting CPU processor, memory/system memory, serial port/external power supply;
Support LCD/OLED screens; The built-in hardware CPU supports HMI memory and SD card interface.
Supports integrated BIOS and fast boot IO, and supports IOT accounts.
Supported driver versions: The latest version of IMA/RAD support, Axial and SDA/SCL.