Can we produce it ourselves and so on. Alternative suppliers must be prepared, and rigid-flex board products must be shared thoroughly. Our company's flexible boards currently consist of four layers of SL flexible boards, which are composed of printed circuit boards. The minimum width of this layer is 32 millimeters, and the minimum spacing between the boards is 25 millimeters.
From the beginning of the sampling order, the welding process roughly includes drilling, through-hole, stacking, blind hole, buried hole, through-hole, etc.
Horizontal electroplating is a good helper for cutting edge PCBs. Vertical electroplating is a good helper for cutting edge PCB using horizontal electroplating.
From the overall situation, there are not many problems with horizontal electroplating. Instead, there is a current passing through the lighting switch and PCB connection line, and analyzing the current from the horizontal edge to the horizontal edge of the PCB will provide some practical effects.

Secondly, vertical electroplating is considered as vertical electroplating, while horizontal electroplating is considered as staggered, while parallel electroplating is considered as transparent. Electroplating occurs in the horizontal direction, once it reaches the positive position. When walking horizontally, the motor must be reversed, otherwise it will cause the copper foil to peel off and produce copper slurry.
Finally, there is no uniform plating and additional water output, which is a complex situation. So it should be noted that different electroplating products have different requirements. At the same time, attention should also be paid to the cleanliness of the electrode structure to ensure cleanliness and pollution-free.
Finally, without cleaning, do not use excessive force when soldering to avoid the solder paste reducing the adhesion on the surface and bottom of the circuit board greatly, resulting in unevenness. When cleaning, do not use flux such as alcohol.
Lead free tin spraying requires that the surface of the welded part be smooth and clean, without burrs or foam. To ensure good welding performance, the solder joints should be full and free from gases, rosin, and other impurities. On the premise of ensuring appropriate welding performance, shorten the preheating time as much as possible and heat the components appropriately to ensure uniform flow of solder and minimize heat transfer.
Tin slag directly wets the surface of the substrate, and the rosin produced by different metals at different temperatures adheres to the surface of the substrate to form a bridging phenomenon. When bridging occurs on the surface of the substrate, attention should be paid to cleaning impurities first. The cleaning agents used are usually rosin or water-based cleaning agents or alcohols, most of which are flux with low solid content, and there are more flux with high solid content.
The function of a degreaser is to remove oxide residues, as well as oil stains and fingerprint residues on poor metal surfaces. Wipe and activate oil stains with a dry cloth. Use a high-power microscope to check for leaks, copper skin, and fingerprint residue. This method is three better than copper alloy scratch cleaning methods.
Especially for electrolytic cleaning of copper (core) and aluminum (battalion) surfaces after solidification of nop, it is called electrolytic cleaning.
Based on the entire process of electrolytic cleaning, Marandine electrolytic cleaning solution was used. Add copper dissolving agent to the raw material of electrolytic cleaning agent to remove copper surface oxides, in order to increase the effectiveness of electrolytic cleaning solution.