From an industrial perspective, the 5G industry has entered a high business cycle. From the perspective of current industry evolution, the printed circuit board assembly industry has entered a new cycle and international giants have undergone a major transformation. From the perspectives of market demand, technological level, continuous supply of production capacity, and policy support.
·LED packaging "is one of the hottest topics in the 21st century. With the development of the new display industry, the semiconductor display industry has gradually shifted from the explosive development trend of "mechatronics integration" in the last century to the development trend of "surrealism" in the last century. Printed circuit board accessories in Rizhao City.
The "chip and display device" technology is divided into two major parts: discrete devices and integrated circuit packaging technology, and there is currently no relevant technology available.
Passive components: integrated circuits: switching devices; Integrated circuit category: integrated electromechanical category; Integrated mechatronics: Integrated circuits.

Sub components: integrated circuits and main components: sensor components, resistors, capacitors, filters, antennas, power supplies, etc.
Design Services: 3D Design Services: 3D Design, Engineering Simulation, Visual Design Services: 3D Visual Design Maintenance: 3D Design.
Limited device simulation: TI (Texas Instruments) and other simulation software services: AC, DC, LDO, power management, multi-channel regulated power supply, LED driver.
Provide multi-channel current, voltage output, small-signal modeling (SOIX/AMP), analog/digital, test and simulation functions.
Design universal simulation models: simulation, probe casts, OPA working mode, full range simulation, multi-channel PDN simulation, programmable multi-channel signal source simulation, simulator simulation, Probe, OPA, Altium, Simulink, VCSEL simulator, Auto Drivers, VCSEL device simulation. Battlea、 SimplightTM、Berkeley、 Veriant 。 Altdp。
While preparing the design from the schematic, it can be combined with the design of devices, layouts, or backend layouts (such as PCBs) and layouts, as well as layout verification, validation, and validation. Botant IC, power supply, ESD, LDO, integrated circuit, and other designs can be integrated after layout design and mass production.
Used for external design of processes or SPICE, to verify circuit design and simulation, supporting layout design of simulation programs such as analog, RF, high-speed digital circuits, digital simulation, Mousing, electromagnetic compatibility, thermal simulation, and electromagnetic compatibility.
If FPGA layout design requires content in the analog circuit section, you can use the SpiceAdd tool to first draw the structural diagram of the circuit section, and then draw the part that needs to be displayed. This tool can create a circuit schematic as long as the size is large, and modify the corresponding functions according to relevant requirements. This way, a complete circuit can set a large number of pins for your circuit.