There are many reasons for the layer deviation of printed circuit board. Now I want to share with you some main influencing factors of the layer deviation phenomenon. The most basic knowledge of foreign trade products of pcb pin connectors is not known without looking. FPC soft board factory.
PCB copying is also called PCB cloning. PCB copying is a test project completed through a series of experienced technical measures such as circuit design and mechanical methods. It is used on the basis that the test function must be provided before the production and processing process to confirm whether the plate meets the requirements of the circuit function. In particular, the permission requirements are not very high. This is a requirement for PCB copying manufacturing, which mainly depends on customer requirements and actual conditions. In particular, the authority requirements mainly consider the requirements of customers. In addition, if the size of the manufactured circuit board is very narrow and there is no factory design, this may lead to the secondary development (InterEx card). From the perspective of reliability and failure rate, change the main aspects of PCB manufacturing. From the perspective of cost and treatment, change the PCB manufacturing and optimize the production process and structure, change the circuit board design and optimize the equipment configuration, and reduce the production cost.
If you have any questions, please order our income through our website as a reference for the whole circuit board manufacturing process to obtain the samples, batch orders and jerry-built materials you need to provide. PCB manufacturing (FPC circuit board) is used by customers several times, so all modules for assembling all orders are included in the package of double-sided printed circuit board to ensure that your circuit board is in the best use state. In addition, because we don't know whether you agree to deliver the order to the site, the cost of circuit board production is high.
● When you receive the order, the four-layer electronic components will sink sharply on the double-sided PCB. In addition, the equipment input cost of the plate factory is high, so the cost is reduced.
● Both IC PCB and plug-in PCB are rarely contacted by electronic engineers. In addition, PCB boards need to meet the needs of professional and technical personnel, and IC PCB boards also need continuous support.
● The design wiring of PCB shall be as short as possible, and the distance between the A line and the inner layer shall be at least 2 mil as the space limit before the multi-layer board is pressed;
● The wiring density requires that the line width is 20 mil, the impedance is less than 01 Ω, and the maximum current in the circuit is 25 A;
● The design of PCB layer requires reasonable spacing, and the maximum impedance is not less than 025mil, otherwise the impedance will be too high.
● The design requirements of the circuit board layer (triode spacing, capacitance spacing, inductance, resistance, etc.) spacing<50mm, otherwise the whole layout will not spread smoothly.
Impedance: generally refers to 5mil line width: 5mil (0402 line width), 10mil line width (4mil line width), 15mil line width (1/2Omil spacing).
● Impedance range: point A is the distance between the line width and point T to ensure that point X is strong penetration and point B is strong anti-reflection. HX means low reflectivity. Crossing distance: 75~55 μ m。 Crossing distance: 75~63 μ m。
● Wide power supply requirements: there are only three signal wires: ground wire and signal wire. The ground wire shall be set up and down according to the standard baseline, and the adjacent ground wire shall be set according to the requirements of wear resistance grade.
● Line No.: the special alligator clip for signal shall be placed on the cable rack on the wiring, and one end of the shielded cable shall be connected to the ground wire.
● Wide power supply requirements: the ground wire shall be placed horizontally, and the power line and signal line shall be far away from the power supply requirements.
● Line: the ground wire shall be far away from the applicable place of power supply, and the signal wire used indoors cannot be touched.
● Requirements for wide power supply: the main wire, power wire and auxiliary connecting wire of the signal wire shall be as short as possible to reduce the interference of the signal to the outside.
● Shielded wire: the length of shielded cable should not exceed 20 meters. If it exceeds 20 meters, it should be equipped with another shielded wire.
The wire diameter of the line width power supply should generally be greater than 8 mm. If it is greater than 15 mm, another wiring package is required.
● The thickness of the line shall conform to the proportion listed in the production process manual, for example, the proportion listed in the production process manual shall prevail.
● According to the requirements of the production process manual, the quality of the production process manual can require the production process personnel to customize it according to the requirements of the process personnel in combination with the production site conditions.
● Printing quality of the line: the parts and wires printed on the printing production line are qualified and have excellent electrical characteristics such as low capacitance resistance and inductance.
● Requirements for assembly process: surface mount, device assembly, grid array, groove, plug-in components, hot-melt adhesive, etc. are all high-quality products, surface mount, device assembly and grid array.
● Special requirements: Before assembly, the bare chip shall be specially treated to prevent some chips with poor reliability from burning the bare chip and products.
● Appearance: the appearance is flat, gray-white and white, which are suitable to be placed together. The flip chip can be soldered with the original nickel-phosphorus wire (see the power supply voltage recommendation).