Printed circuit board, abbreviated as printed circuit board, is one of the important components in the electronic industry. How to quickly and effectively select printed circuit board assembly? All aspects we need, including high-value bandwidth and high-speed ADAS, will receive reliable, accurate, and reliable measurement systems. All minimum points visible on 3D fault surfaces will meet the requirements of tens of micrometers, as well as testing the positioning performance of surface scanners and information transmission of 3D points.
Device micro/nano manufacturing technology is the most advanced technology in the world today, which operates with extremely small electron longitudinal and transverse currents (ms). Compared with traditional manufacturing methods, it uses internationally advanced material technology to combine engineering systems.
In addition, advanced surface scanning technology exhibits abnormal surface resistance as the SMT temperature increases under the strong effect of electrostatic discharge, as shown in Figure 4-1. Now we can use more electrostatic discharge methods to solve this problem.


The failure mode of electrostatic discharge is the generation of high voltage on the copper foil or hole substrate on the PCB console, and the current flows through the device, so electrostatic discharge phenomenon is common. The danger that electrostatic discharge can cause is the high-voltage electricity generated on high-voltage machines such as electric soldering irons, which exceeds the voltage released at the working point of the device. Electrostatic discharge occurs on PCB boards, and when the electric soldering iron contacts, the resistance of the thermal conductive body to solder penetration increases, causing the solder joint to become conductive. Severe cases can lead to soldering, such as chips on PCB boards, and even generate significant static electricity on solder joints through polarization electrolysis. Therefore, for precision components used in circuit design and welding, such as electrolytic capacitor, IC, etc., especially for PCB boards of some small components, solder joints are easily covered by static electricity and lose their protection. Precision components in circuit design, such as high-power transistors, high-power transistors, and many integrated circuits with large packaging components, also have a large welding area and component welding area, with a small number of solder joints, making them prone to missoldering and solder leakage. The process of introducing gold-plated points in the early stages of circuit board maintenance makes contact welding more difficult. Moreover, with rapid development, it is also prone to the occurrence of false soldering and missed soldering. The boards of multi chip modules have been produced, but they still need to undergo mass transformation. Secondly, for soft and hard boards, it is necessary to achieve the ability to produce defective products in all process areas according to the designed boards, and then improve and develop them. Then, the general production methods include wire tearing, V-CUT, S/TAB, V-CUT, and V.
The most basic approach is to divide the electronic component area on the PCB board, and then divide the S/T/D/T type connector to make it.
Because the industrial boards of PCBs are equipped with shielding to prevent electromagnetic interference from other areas, but it may also cause EMI interference. Therefore, it is necessary and necessary to pay attention to whether each layer of the PCB is on the same side.
I made this table based on the quality research needs of several major reflow soldering furnaces and four major plug-ins, which was also known by a PCB practitioner rather than through study.