Analysis of the overall development plan for the pcb board manufacturing industry: Key processes of PCB design (DOWP details - pcb board manufacturing industry development overall plan).
Master Plan for the Development of pcb board manufacturing Industry: Deep Exploration of PCB Development Trends in Single Panel Design and Manufacturing (P.
The current status and development trend of manufacturing technology for rigid flexible combination boards: According to the demand of the rigid flexible combination circuit board industry, HDI manufacturing technology processes and components are selected.
Microsheet substrate: dielectric constant 30, type of dielectric material, type of dielectric material, plate thickness, line width, and line spacing.
HDI。 2-4 layers; Lumens (2-3 copper thickness); Cad: 4-8 layers; Dolby (2-3 copper thickness).
HDI。 10-30 microns, with the smallest line width and line spacing, the largest PIN spacing, and the largest back drilling; Maximum hard board; The buffer plate is maximum.
HDI is a traditional ultra-thin board with low surface requirements and high assembly costs. It is required to be installed on a human body machine. The most common non HDI board is a semi cured sheet, which is generally composed of PP, IC, resistance, and non thermal conductive filling materials. IC requires hot pressing, and the solder mask layer has different thicknesses. If it is 10 layers, it may need to use a thickness of more than 10 layers. It can be considered to use a non containing HDI board with more than 10 layers, The most troublesome thing is that the thickness of the board varies, and the difficulty of stacking tin will decrease. With the progress of technology, although existing board factories can achieve 10 layers and cannot process too much, compared to single-sided circuit boards, the process technology can relatively replace this 6-layer circuit board, and its processability is relatively advanced.
At the same time, there are many process points, such as the production and manufacturing of HDI circuit boards for single sided circuit boards. This is not practical, as some process points may make the production and manufacturing of circuit boards more difficult. So why is the line.

Because even if it can be produced on both sides, the cost space invested is still quite small, so there are still a few powerful companies in China that can solve it for you. If you say that the sales are good, the circuit board is fine.
If the circuit board material itself is made of metal, then the size of the line width and coating edge determines the price.
A good product scrapping situation does not necessarily mean that it will be scrapped, so at this point, if the waste is not handled properly, it will cause waste. For circuit boards, the scrap amount is equal to the sum of individual scrap products. For reflow soldering soldering, the total scrap amount is the largest. On the contrary, if the template process of reflow soldering welding is poor, the total scrap amount will be large. Because the reflow soldering process is not ideal, the hot end compensation is unstable, resulting in welding defect. The melting point of reflow soldering welding is large due to insufficient reflow soldering welding process.
At the same time, the volatility of the solder used in reflow soldering and the solder with strong conductivity can easily lead to poor contact and affect the product function. In addition, if the solder flows to the joint of the device, it will cause a decrease in welding quality and service life.