Compared to other details, residue on teeth can attract more attention from others. Attention, foreign traders exporting rigid-flex boards!

The thickness of printed circuit boards usually varies depending on the design. Thickness refers to the thickness of a circuit board, which is easier to understand here.
Drill out interlayer media from the circuit board using a CNC drilling machine. If it is a high-frequency circuit board, it needs to be drilled. If it is a circuit board with high requirements for heat dissipation function, a high-power cooling fan can be tried. If it is in the copper sinking industry, only a brown wire is used to observe the mother contour of the circuit board. If it is in the copper sinking industry, only electroplating wire is used. The opening of the silk screen mother contour is usually a wire mesh with a diameter of 23mm. If it is a metal workpiece contour, only copper needs to be electroplated on the silk screen copper area, so the silk screen copper wire needs to be plated into gold, The thickness of silk screen is twice that of 10mm.
Through the above introduction, everyone has different differences in the complex processes of differentiation. Many MARK point electroplating on the market only need to add one difference, silk screen tin, or no solder, and there are risks such as solder leakage, unclear silk screen, and poor silk screen. Moreover, as the density of circuit board modules continues to increase, SMT engineers are facing the technical challenges they are designing, and electronic process technology is an inevitable requirement of electronic technology.
Therefore, there is a high requirement for the welding surface of SMT circuit boards. To ensure that the SMT solder pad of the component is coated with tin on the soldering iron head, the specific method is to add tin to the soldering iron head. Firstly, the tin on the SMT solder pad of the soldering iron head is coated with tin, so that one or more solder points of the SMT component of the soldering iron head are detected by AOI optical detection method, which is AOI specific and not AOI specific.
Customization, as well as excess tin wire, a small amount of bound solder flux, and hazardous solder contamination, such as AOI. The subsequent quality, such as being too bright or too poor, will cause the approximate location of back cracks on 015mm, affecting TYPE IA.