According to the GMP standard acceptance QS standard acceptance, the qualification rate reaches 100%, and the acceptance standards and methods for rigid-flex boards.
● Acceptance method for rigid-flex boards. See figure. (2) Flexible board acceptance method. (3) Testing method for through-hole flexible plates. (4) Inspection method for blind hole flexible plates. (5) Blind hole flexible plate method. (6) The first probe of a blind hole flexible plate is defined as a flexible plate (ClipCamp) and a through hole flexible plate (MoldCamp). Flexible board, blind hole buried hole flexible printed board factory in Fujian Province.
Blindvd via: Blind holes are through holes in printed boards, and the area occupied by blind holes.
Scurend via: Generally, buried holes are used, and the proportion of blind holes is only the aperture.
● Multilayer board: In order to more effectively ensure the reliability of blind hole and buried hole designs, 1/4 of the holes, lines, and component solder pads are reserved, and special situations require reference.
Each important edge of the buried blind hole design has only one GERHOND (blind slot) at the GERHOND (clock) position. It should be noted that GERBOND has a ± 8 mils solder mask layer.
● The recommended minimum size of bonding pad for SMD processing is 334mm for Electrolytic capacitor with 762mm spacing.

The SMT processing technology determines the straightness and appearance of the product, but it is necessary to ensure sufficient light leakage and exposed copper foil.
When using multi-layer board gongs, try to use metallized holes as much as possible and facilitate processing. When using the gong board, PCB holes are prioritized to be used exclusively for areas with internal short circuits.
Do not open wires, especially power and ground wires, in the half hole, and do not open them under intermittent current.
The power cord and ground wire should be locked tightly to prevent reverse insertion. The lower part of all power cord loops should be supported with cord loops to prevent resistance thermal radiation and avoid phenomena such as not overlapping or not overlapping.
● Look and the power cord should have a dedicated engineer provide the wiring section labeled with the power supply. The position of the power cord should be flexible and appropriate.