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How can the printed circuit board assembly industry break through again

Applying three proofing paint to printed circuit boards and components can reduce or eliminate the degradation of electronic operating performance when it may be affected by adverse operating environment factors. How can the printed circuit board assembly industry break through again.
Three proof paint. Three proofing paint is also a chemical cross-linked coating that is widely used. Widely used for protection between circuit boards and organic chemical grade materials. It can protect the circuit from external damage and prevent the dissolution of the three proofing paint. There are many types of three proofing paints, including acrylate, silicone, and polyurethane.
Three proofing paint is also a chemical cross-linked coating that is widely used. Three proofing paint, acrylic ester, polyurethane three proofing adhesive, thermal conductive silicone grease, and radiator, etc. Both electronic product manufacturers and equipment manufacturers can be protected with three proofing paint.
● Coating: In order to protect the coating and facilitate operation, the circuit board assembly industry provides surface protection for circuit boards, generally to prevent them from the effects of moisture, salt spray, thermochemical corrosion, etc. The coating can protect the front and may be affected by various factors.
Preheating: It can be used for hot dip, infrared, ultraviolet, gas, infrared, infrared thermal imaging, etc.


● Welding: in order to avoid unnecessary circuit board welding, hot melting shall make it withstand two thermal shock.
● Reflux: In order to maintain an effective working life of the circuit board for a long time in the expected working environment, sufficient protection can be provided for the effective soldering of the circuit board, and the oxidation and soldering time of the solder joints can be reduced.
● Cleaning: Removing what may cause residue on the circuit board after use for a period of time may lead to poor adhesion of chemical nickel on the circuit board, which may lead to adhesion of solder, as shown below.
● The test equipment shall have clear fault diagnosis rules, and the test results shall specify the test report and the integrity and accuracy of the test data, so as to evaluate various welding defect and residues that may occur on the circuit board.
Test points: Test objects: cables used to test non test points, short circuits, open circuits, through holes, inter board connectivity, and point contact of semi-finished boards.
The performance indicators of the machinery shall be inspected according to reliable testing requirements for the inspection content of equipment or assembly quality.
The testing method measures parameters such as contact resistance, insulation resistance, winding resistance, conductor resistance, insulation resistance, dark current, etc.
The testing instrument mainly achieves fault location of simulator components and circuits, as well as testing of fixed value circuits, by setting the driving AC power of electronic circuits and electronic circuits, as well as the working principle, main components, structures, and components of electronic circuits. The main performance indicators are as follows.
● Test requirements: Test voltage: 55V ± 5% (measurement display accuracy below 01 ° C);
● Test current: below 100A, below 10A (maximum normal load), above 20A (maximum normal load).
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