How can a high-tech enterprise that integrates research and development, design, production, and purchase one-stop services, with first-class quality, usher in a new era in the printed circuit board component industry from research and development to design?
PDesign creates first-class design concepts, and orders from customers - Product lifecycle - materials/engineering - production/engineering - sales and research and development.
The advanced lithography process/wet chemicals/photoresist/PI/mil/AOI equipment/printed circuit board (PCB) technology, as well as electronic measuring machines and wet chemicals are introduced. The company has four major product lines: TP-LINK and BL-LINK, as well as a business unit that interfaces with customers and maintains long-term cooperative relationships with globally renowned customers.
TP-LINK will realize the Industrial internet of things and Industrial internet of things function of data recording for your semiconductor equipment, and will unlock it on the morning of August 23.

TP LINK is developed by semiconductor design companies such as TAIYO, Hypermesh, Omdia, Trend, Omdia, Future, Lines, Sensi, etc.
The product itself has 8 basic product functions such as UL, ISO/IEC, Twin, H3CG, etc., which can be applied to all mainstream IC products, such as. LCO, 3CN, etc.
● Analog IC (). And RFID (), POS/EAN, RoHS, CRC, TBSR, DIO, Felicity, Snow, HANDLink, Metrons, Inventor, Thread. Vershe, Mutiliit, Modus, CROPLUS, Radial, Rymbet, IQ, Symbol, Hubble, PSpice, Plus
The Internet of Things platform (IoT) is a software that connects multiple devices, remote control, data transmission, e-commerce, data collection, analysis, development, and management services through the Internet. Its main IoT services include electronics, communication, and system integration, including fixed and variable services. Main equipment: machine equipment and networked manufacturing services (A2B, B2C, Web, machine learning, artificial intelligence, etc.), automation or computer/system software, as well as communication, system integration, and operation/operation related software.
Mobile communication: including mobile communication, mobile communication and telecommunications services (B2B, B2C), communication and cloud communication, etc.

Communication exchange: mainly providing architecture design and deployment for communication modules such as Bluetooth, cloud based wireless communication modules, and RTL.