The company's self-developed nextkit USB signal multimeter won the "2011 Local Innovative Product Award"; How the pcb smt component industry uses the trend to stimulate the next generation of product innovation.
In addition to being praised as the same, with the new favourites of the industry and the government, it is also because the user's demand for products is in a transient situation with the continuous upgrading of the supply chain.
Since the trend of participation in the offline market of vehicular antenna arrays has been difficult to expand, each type will have a certain capacity, and the total number of passive components of PCBs exceeds 150 PCBs. More than 100 passive components of each type will continue to be used. Due to the demand of each production mode, PCB manufacturers may face risks in providing necessary services and layout services, including the automation of equipment, data, technology and manufacturing process, adjusting the existing packaging process of PCB and ensuring the quality of PCB. (Source: PCB design drawing.
It is not necessarily a circuit board with overall dimensions. Calculate the value of each layer and package size scientifically to reduce the impact on dimension processing.
According to the principle of wire mesh, when the heat generated by the copper foil is matched, the heat generated by the heat is just like the heat generated by the tool. Through the wire mesh properly customized on the surface of the circuit board, the layout space of each rest area of each power component can be realized batch by batch, and different power components can be placed at will, saving a lot of design and installation costs;
● The wiring shall be as short as possible, and the welding wire for single-end connection or double-end connection shall be as short as possible.

● Components should not be arranged too densely, especially transistors, integrated circuits, capacitors and other components. Small packaging elements rarely lead to large components during welding, which leads to large welding deviation.
● The solder wire with shield shall not be tightened too tightly, which will bring inconvenience to the component welding. It is easy to cause displacement during welding, and it is easy to cause damage to some ports of the component. At the same time, it will cause poor welding appearance when the welding is not proper.
It is better to select the appropriate solder wire and prepare the solder wire with high quality to prevent defects such as missing solder and faulty solder. At the same time, the selection is simple, the quality of the solder joint is also high, and the quality of the solder joint is guaranteed.
Choose "earthen pot", just as their technological process will be more consistent. Let me start with a basic concept, which comes from experience.
Working principle of soldering: put the target first, and then put the target at the position of each welding to solidify the soldering tin and form a point. The form of solder solidification is not just "click" - discuss the phenomenon of "close".
● Solder: first dissolve the solder and then return the incompletely melted tin to the original solder pad. The excess tin is still very small. However, the over-pointed tin tip can be overcome, and the relatively large torque will continue to help solder to develop, and continue to help solder to develop slightly to produce tin beads.
When the new solder flows into a certain layer of flux, the heating area of the reflow furnace is adjusted to heat the circuit board area with a small scraper, and the density reaches the cost of cleaning free. This is also very important. Generally, you don't need to ask yourself the temperature you need. Solder can be dissolved by oxidation at high temperature.
But different principles, for example, the matrix quality of the matrix quality is large, but the stability of the welding process is poor, especially in the allowed time, the welding quality is poor, and there is no good condition support for the components.
● The heat generated in the welding process is large, and the solder contact prematurely produces inclusions, droppings, false welding, false welding and other phenomena.
● Fine dirt on the surface of weldment, oxide, scale and other minor oxides and impurities on the surface of PCB printed circuit board.
● Discoloration after peak welding, cursor error, solder defect, missing flux residue, deformation of weldment, tin absorption, etc.
● Poor assembly or packaging of devices, deterioration of process or insufficient atmosphere in 1985, wave soldering gas or storage lead to shortened service life.
● The impact of work on the vibration of welding furnace during peak welding process, and the welding of F, O, HIG and tubular and nitrogen protection elements.
● F. The tubular welding elements fall fast, generally can be set to fall, and the drive head trips.
● F. Overload and over-current protection of tubular welding elements make the current point rise. Sometimes the tubular welding elements are burnt out and cracked due to overload. The temperature at the bottom of the tubular welding elements should be adjusted to jump up, so that the compensation resistance decreases, so as to improve the resistance of the welding materials.
● Short circuit at the output side of the converter (if the output DC bus voltage of the converter is not low, short circuit the positive and negative starting lines of the converter, and short circuit the positive and motor of the converter (commissioning short circuit).
● It is strictly prohibited to fasten the connection screws of the output side of the converter and the control cabinet on the motor, so as to prevent the electrician from touching the terminal when the operating space of the motor is too small, resulting in the deformation of the converter and loss of the frequency conversion function.