This streamline production solution helps to eliminate the quality control problems caused by the conversion of circuit boards between different processes. Every foreign trader should know about printed circuit board assembly products. In the past, we used HDI technology as a transition flow plate for high-density wiring. The HDI technology provides a combination of rigid and flexible rigid conversion flow plates. The evolution of HDI technology has evolved into mechanical assembly technology (CNC) assembly technology for circuit board assembly.
The first type is made with metal wires, which is more reliable than parts made with metal wires. The second type is made of metal wires, and this assembly process is achieved by increasing the metal end face and stress sensitivity of a component. The third type is made of metal wires, which has the disadvantage of complex processing technology and poor organizational structure, requiring the use of a method without connecting wires. The third type is made of wires, which tightly place the wires used earlier on the metal end face and place the circuit on a circuit with the same principle. Therefore, this type of circuit is a thin, conductive wire suitable for making high-power, high current switching power supplies and AC input power supplies. In places with high requirements, wire production should also be used, such as transformers, coils, etc. Laser soldering for SMT chip processing is a relatively good laser process. The process of laser soldering is relatively good, but the disadvantage is that it only requires a special laser process to complete a very complex welding process. Due to its large volume, it can easily affect the quality of the product, and even a slight mistake can result in the product being scrapped. The process of laser soldering is not complex, it only requires a high-efficiency solder paste soldering, which is the simplest process for soldering chips compared to one process.
The key point of customized electronic material manual welding process is when customizing the solder paste process. Almost all processes require the use of laser solder paste, which is the goal pursued by most manufacturers.

Dongguan Yongjie Electronic Technology has developed SOP8, SOP8 packaging, and highly reliable product packaging.
The implementation methods for the production plan of a fully automatic solder paste printing machine include the following: 1. The principle of solder paste printing: 1. The principle of solder paste printing: the solder paste is manually returned to the furnace; 2. The fixing frame of the solder paste printing template (such as: solder paste scraper (top scraper)+PTH offset printing knife (top scraper)+knife holder (scraper)+light knife (finger mold)+solder paste (bottom scraper); 3. Printing of solder paste after heating; 4. Printing of solder paste for printed circuit board processing; 5. Solder paste packaging after printing solder paste on printed circuit boards; 6. The movement of the printing hard template peels off the printing heat transfer film.
Use computer software to process PC packages that use PC packages, ensuring the smooth operation of SMT welding.

Screen the materials required for SMT solder paste and record safe and accurate information in the database to protect the safety of SMT patches and related materials.