However, the decrease in intermolecular activity hinders the transfer of electrons. Adding obstacles to the export rigid-flex board! Soon, the molecules related to the flexible board experienced a "jump" phenomenon.
Like vacuum or organic polymers, organic metal oxides have the ability to tightly occlude non crystalline rigid and flexible adhesive tapes, isolate oxides, and do not undergo polymerization reactions. Products made from flexible printed circuit board copper foil, epoxy resin, and their composites with excellent temperature environments also have the main characteristics of flexible heat resistance and bending resistance.
In environments such as NPI and DCA, more circuit boards can also achieve their own flexibility.
The structure and copper content of epoxy resin are different, and there are almost no resin flexible materials with epoxy resin flexibility in the market, such as epoxy resin and copper based composite flexible materials.
Due to stricter flexibility requirements for epoxy resin, its versatility and processing performance are more stable, reliable, and durable, and it has been recognized by other major civil and electronic products in Europe and America, with varying prices.
In some cases, due to the degree of contact between temperature, humidity, and other media, the corrosive nature of temperature and humidity can cause excessive temperature rise on flexible printed circuit boards, and directly affect the connection, performance, and lifespan of conductors and printed circuits; Another situation is the temperature difference between the conductor and the printed circuit board. Different temperatures and humidity can also cause temperature rise, and the connection and performance of the conductor and the printed circuit board will also change;
The size of performance has a direct impact on the lifespan and mechanical properties of the product. Adjustment methods can be used to increase the connection point between the conductor and the printed circuit, so that it can withstand greater current without breaking.

The insulation resistance of PC has an important impact on the insulation of devices. For the same device, the maximum insulation resistance value should be between 25M Ω and 55M Ω. A resistance test of 1 million times is necessary for the insulation of devices due to its high impedance and on state resistance.
The general voltage withstand test is usually conducted at M Ω, V is 5V, and mV is 0V. The items to be tested are (between U1mA and R1mA), (between R1mA and R1mA), (room temperature resistance/(between EG1mA and R1mA), and (between R1mA and EG1mA).