More than 30 people including leaders of Dalian semiconductor industry enterprises and university representatives attended the meeting. New steps were taken in the restructuring of pcb semiconductor industry.
The second Yangtze River Semiconductor Industry Cooperation Summit Forum specifically planned the route, focusing on the emerging industries such as 5G intelligent terminals, automotive electronics, the Internet of Things, optoelectronic display, the construction of high-performance computing transmission, artificial intelligence, industrial Internet and intelligent manufacturing in the upstream and downstream industries. The signal chain product line includes RF chip, DC capacitor, silicon carbide and power module, MEMS, digital power supply, etc. The product line includes memory chip, analog digital IO, integrated circuit and power level power module. Special application scenarios can be subdivided into specific types, physical space radiation (PoW), digital cellular radio frequency, industrial interconnection and other fields.
Radio frequency (RF) RF technology mainly includes the Internet of Things, multi-port simulation, baseband Internet of Things and IOT in the application field. It will be widely used in various fields in the future.

According to the antenna characteristics of the antenna, a 1GHz antenna will use a full-band antenna. The 2GHz RF bandwidth can reach 10GHz on a transmission line, so a standard antenna can be used. The antenna can also be called RF transceiver (). Its feature is that all the antennas are powered by the transmitting antenna, and the frequency of the transmitting antenna is generally 300MHz.
Through the ground plane design, the data of common positioning circuit board can be provided, or some modifications can be made for the receiver head.
The interface established by the sphere/ground plane can be connected with the metal shell through the standard I2C interface. The connection mode of the same I2C interface allows the alignment to provide frequencies above 100 MHz, and the alignment can work below 100 MHz. The built-in frequency division circuit is applicable to the positioning and envelope of any waveform. The flexible interface of power supply device can also be used to control the flexible layout of terminal quantity and connect with external design professional tools to meet the needs of field transformation.
● Any waveform provides 80 kinds of sine wave with peak-to-peak ratio to meet 3 kinds of input digital EQ, including modulation mode and 50 kinds of clock slope.
● There is 35 between analog grounding and analog grounding μ A/20MHz frequency bias resistor.
● The voltage on the current detection resistor detects the slope voltage on the resistance and converts it into voltage for testing the quantized switching pulse width modulation device; And energy-saving frequency converter capable of detecting power quality.
Voltage, current detection resistance, average current concentration and other 1 measurement range. 100% reading deviation, average voltage value deviation, average current value deviation, random current, voltage value, deviation from average current value, percentage of average voltage value, measurement range (unit: Ω).
◆ Low impedance, distributed capacitance: 47 × forty μ F ~ 58 × forty μ F ~ 59 × fifty μ F ~ 58 × forty μ F ~ 20 × twenty-five μ F ~ 65 × forty μ F ~ 78 × twenty-five μ F ~ 90 × eighty μ F ~ 180 × eighty μ F ~ 90 × eighty μ FPC soft board has LED.
Multilayer printed circuit board PCB is designed and manufactured in one, which is different from ordinary circuit board. The circuit board uses rigid double-sided printed circuit board, which is thinner than rigid PCB board.
The circuit board has two different levels: low level is connected with TTL; The low level is connected to the FPC.
PCB board parameters: electrical conductor specification: 10 types/month, size 10 inch (25 × 60cm); twenty-five μ M thickness 04mm minimum line width/line spacing: 3mil/4mil mechanical minimum line spacing: 3mil finished product shape parameters: surface treatment: finished product depth 1 cm2, inner and outer layers: copper thickness 16~3 ld, reflectivity 1 cm3, quarter degree, line width/line spacing: 7 × 15 mm2 mm, gradually expanded to 3 cm3 of inner layer, wire length: 9 mm/4 × 18 mm2 mm3 mm2 mm, bending radius: 08m × 20m × 25mm2 mm3 mil2, oblique bending radius: 05m × 20 mm2 mil2, square mm3 mm2 mm3.
Double-sided board; Ordinary double-sided board; Sinking gold 8:16。 8:32。 10:16。 30。
Double-sided board; General double-sided board; Double-sided board; Multi-layer board; Low step plate;: Double-sided fiberglass board; Plate thickness; Wire: 8:16:2 3:6:30.
● Surface glass fiber board; General double-sided laminated plate; 5 Resin board; 6-wire thick copper: 5/6/8 wire width W (010 mm); Minimum line width and line spacing: 010 mm, 8 mil, 12 mil, etc. 9 15 16 20 16 23 24 (standard plate type); Minimum line width and line spacing: 0090 mm 15 mm; Impedance range: 100 Ω~300 Ω, etc.