Install the packaged electronic components in the corresponding positions on the circuit board. What methods are used to conduct market research on printed circuit board assembly.
Whether the surface of the PCB is flat and there are traces of cracks, representing the capacity of the capacitor. Is the capacitor shiny and what is the reason; Are there any hidden fabrics, electrical traces, etc.
● Resistance regulation performance. If there is no printed pattern on the printed circuit board, it is required to carry out the printed circuit board sampling process. Before printing samples, engineers must understand the 'precision tools'.
● Work difference calculation. Using precision tools to determine line width and line spacing (6), high-precision measurements are first taken, usually in units of each foot.
Angle milling. Be careful not to cause changes in line width and spacing, as this may result in a decrease in line width.
● Pipe groove, use a 2mm thick glass drill bit to simultaneously clamp the hole diameter at the milling cutter diameter, and then fasten the metal bracket embedded on the pipe.
Components such as thermocouples, BGA, CPU, etc., such as all machine parts at the rounded corners of the end of the milling cutter diameter and the rounded corners of the positioning hole.
● Welding stress, such as: machine tool fixtures and hydraulic drive models at the end of newly drilled threads; Dead corners and friction angles of machine tools; The deformation of the rotating shaft caused by workpiece deformation.
According to the regulations that do not exceed the actual usage conditions, within the range required by the user, the maximum allowable amplitude of the operation:+15%+ 55% ; 015%; 10nA; + 55%。
From the current technical capabilities, it is necessary for staff to accurately judge the quality of the system and specific pin combinations before and after debugging or installation, device installation, and even pre and post calibration, in order to verify whether the equipment/fixture to be tested meets the requirements.
From the current technical capabilities, by selecting the equipment to be debugged and installed for testing, it can be determined whether the equipment/fixture to be tested meets the accuracy requirements. For connectors on the testing site, there may also be high-frequency and low-frequency situations. In this regard, it is necessary to consider testing fixtures and isolator terminals, using more accessories, and upgrading connectors to improve the anti-interference ability of the testing site. In addition, it is also necessary to consider the correct installation plans for various connectors, which can also shorten the time required for replacement testing.

The latest generation of 3D technology is aimed at reducing the cost of traditional equipment in China. The existing system has adopted innovative structures and software development techniques to achieve four different types of 3D connectors. However, there are two different issues caused by various electromagnetic field changes: firstly, reducing the cost of simple PCB design, improving speed and production efficiency. The second is to increase the SMT process and production technology. For PCB design engineers, you should know that the main performance of printed circuit boards is the SMT process.