It is a year full of challenges and opportunities. The century long changes and the global epidemic are intertwined, and the international economic situation is becoming more severe and complex. In the coming years, the rigid-flex board industry and other market situations will still be severe and complex.
According to the latest data from the market supply chain, the six largest vertical flexible panel application markets worldwide have a scale of 54.1 billion US dollars and 63.1 billion US dollars, while Thailand, Vietnam, and photovoltaic manufacturing are expected to leap to the second largest in the world and become the global core market.
The main factors for placing orders in October are flexible panels (FPC) and rigid flexible composite panels (HDI), with specific areas including flexible panels, soft and hard composite panels, as well as other ancillary equipment, raw materials, spare parts, and consumables.


Although a limitation possibility in the traditional field is only a part of the ordinary field, there is still great room for development in the current field. This is also an inevitable factor in the gradual transition of the traditional industry from automated robots to the era of intelligent machines, driven by the cyclical drive of PI.
International major enterprises and research institutions can use advanced automatic linear rings, high-speed multi axis rings, and multi axis rings to design intelligent servo systems or software, while ensuring the highest value accuracy, to achieve precise production through industrial robots.
From the early stage of FPGA development, circuit design engineers using FPGA implementation are also known as SoC software engineers. A board with a highly reliable architecture and a very complex system structure has more software components than before, and it only takes one year from factory construction to production. We will start developing a new automatic wiring framework from here, and today we have products and engineers. FPGA has an independent wiring platform for automation. Currently, there is no design for FPGA with digital analog differences, flexible wiring, and compatibility. Of course, there are also Bluetooth push systems and simplified solution designs. At the beginning of the design, the main task that needs to be completed is software testing. In order to establish the layout, it is necessary to check three surface mount devices. To achieve automated testing of the testing software, it is necessary to have Bluetooth push and other functions. The bottom layer of the system is equipped with development testing boxes and interfaces for testing software. In some scenarios, software and hardware testing is also required.
Testing APP: Common testing parameters for ICT include: pull-up input method, pull-down input method, bias current method, duty cycle method, VCC input method, 10W output method, 1W output method, N-channel transient voltage suppressor, Schottky diode, leakage current detection resistor, Schottky diode, Schottky transistor, transient voltage suppressor, impedance method, MOS, gate controlled rectifier, safety testing diode, Schottky diode, ESD discharge energy detection diode FSKL, FQM, DFF, etc.
AO212 characteristic symbol AO3222 MOS tube price AO3222 MOS tube is an enhanced type inside the tube, which can improve the charging and discharging capacity, improve the switching speed and efficiency, and increase the alternating switching frequency.