Driven by Moore's Law, the electronic industry is becoming increasingly powerful in terms of product functionality and integration, and investors are paying closer attention to new products in the printed circuit board assembly industry. At present, the market is basically no longer approaching zero, which is mainly aimed at ensuring the demand for more powerful applications.
These claims can become a unique interconnect prototype to protect BGA from switch analogies. Here, we will consider how to manufacture the smallest product at the lowest rate. It can help create better signal integrity while reducing microstructure switches, allowing people to increase work density by designing circuit boards and software.
In such a large-scale market, the high turnover rate of these interconnect suppliers is irreplaceable. Manufacturing high-density circuit boards is highly competitive, and only by using advanced SMT manufacturing technology and products provided by international advanced equipment and standards can production costs be effectively reduced.
To achieve this goal, it needs to be a key focus for achieving it. In recent years, in addition to developing new functions for electronic products, it has also required that all components of the designed circuit board should meet this requirement in the most reasonable way. The welding process of SMT welding includes three basic elements, namely, silk screen, mounting, reflow welding, silk screen, detection and maintenance, as well as quality inspection, repair, positive and negative, short circuit, open circuit, etc.
The tested material shall not exhibit delamination, and shall not have defects such as pits, folds, burrs, pits, bubbles, etc.
The surface of the testing fixture must not have defects such as scars, layering, cracks, broken wires, or short circuits that affect its quality, or material or insulation.
● Testing will restore the testing fixture by sending 2 small holes for the next process; If it is difficult to recover, the customer needs to request a simple communication with the company's technicians.
Check the testing line for poor contact, impurities, etc. The gap between joints and shafts must not exist. After the measurement is completed, the product manual should be provided.

Check the contact surface and conductor surface of the connecting terminals, whether there are virtual connections with screws, whether the printed board is bent or deformed, and whether the metal foil is in good condition with the contact surface.
Check whether the signal wire is connected, whether there are gaps, bends, etc., and determine whether the terminal is deformed, whether the conductor is loose, and whether the wire group and insulation material are poor.
Check the rectifier and bridge rectifier protection of the motor, check if the rectifier components are in good condition, whether there is any burning through or damage, and pay attention to precautions.
Check the power level. If the AC transmitter has a hard start, check if the wiring between the contactor coil and the contactor is disconnected. If the connecting wire is disconnected, check if the contactor is disconnected, and check if there is no output voltage at the DC contactor core or ground point of the thermal relay. Check if there is resonance in the input and output filter networks, or if there is flying wire phenomenon when disconnecting the power line, output transformer, and jumper coil of UC3843.