Effectively control homework to ensure that products meet quality requirements. Scope: Electronic Manufacturing Services product sharing must be read through. With the continuous upgrading of the electronics industry, the reliability of the entire product is increasingly improving, and the requirements for factory automation production and other modules are also increasing. Function: One stop service for testing and PCBA; The customer's requirements are becoming more and more detailed. Why should we classify products into the following categories? On one hand, it includes as many processes as possible, and on the other hand, it also includes separate upper and lower processes, through holes, and surface mounting processes; In addition, there are several specialized processes involved. How can we consider the material issuance process, material issuance, packaging, and storage required for general products? Therefore, it is necessary to comprehensively consider the process flow, production process, packaging, storage and transportation steps, etc. The main impact is to learn together below.
The process of component issuance: 1. External mounting of components (usually two or more types): enter the automatic pre packaging machine from the feeding station, place it on the workbench, and forcibly transfer the material to the pickup and release device for real-time online packaging by a dedicated person. The cylinder blanking is pushed in by the robot, and the mounting head blanking enters.
Components are allowed to be placed directly on the board. The component should be placed in SOP mode, facing upwards and on top of the component or below the board. The component is placed on the assembled disk, called component vertical, and the component is inserted onto the circuit board (PCB).
Mount component pins to improve assembly density. But these points are often caused by a large number of small pins (or improper thickness).
● Peripheral IC (SOHO) of the reference point. In general, the reference point is equipped with a gate and ground pin to control the pins. When using a microscope to metallize the circuit board solder pads based on these points, and then using thermoelectric drilling techniques to drill out small gates and nickel pins to decouple multiple ICs, and observing them with a magnifying glass, the parasitic capacitance between the gates and nickel pins can lead to high leakage. When using bare wire connections, as the pins of the bare wire are on the top of the power terminal of the printed circuit board, as well as on the device pins and the pins, there must be an isolated safety isolation switch to prevent reverse entry of the reverse device!
Through a single slot structure, complementary circuit boards and power sockets can be placed on the same board to increase reliability. A single slot with multiple slots can have more complementary power interfaces, which is also convenient for achieving the "complementary" power supply of the entire power supply. The advantage of this single power supply is that it can provide low power for the entire power supply.
Power level operating mode of. It is the ideal choice for all other power applications. At the same time, this power supply can provide high performance between audio and power switching rates, and adopts a new power design. Therefore, power supply provides power management and higher efficiency.
Grid tests are usually completed during testing. Power testing is usually completed during the testing period. During the overall testing period, power supply manufacturers can choose customized power supplies according to different needs.