Components with high potential differences should meet the specified safety requirements. New economic and trade regulations for printed circuit board assembly will be implemented! High voltage components conduct mutual interference conjugation using a new template design, which is prone to short circuits exceeding the limit in some cases!

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Since the beginning of this year, the added value of China's electronic industry has shown a slowing trend, overall higher than the global average, driving the strong demand for electronic components, and the overall industry is expanding.
The TPCA Global Development Assembly (Business) for 2015 was recently published.
A report from major electronic manufacturers worldwide released by IDC recently shows that the global manufacturers of packaging substrates (including carrier boards) still hold the top position in the world. With the development of downstream IC packaging towards lightness and thinness, many packaging substrate manufacturers have been able to address the advantages of packaging substrates, such as improving chip pin density, power density, packaging density, and packaging performance, and it also has many applications, And it also has a gradually mature process.
Multi layer: When used for liquid tin foil on multi-layer PCB printed circuit boards, or to form a bonding layer on the surface of the PCB, and to facilitate surface contact of the electroformed layer.
Vacuum impregnation: sintered and welded vacuum (or vapor deposition) polar solder paste to the seam of PCB to form electroforming layer, and reflowed with high precision.
Chemical: Used to prevent the coating of the oxide film from being "oxidized". For coatings without an "oxide film", a thickness of 12 microns is usually required. In certain areas with low requirements for film thickness accuracy, the coating should be removed by a relative surface area oxide film and should not be corrosive.
Transformation: Generally speaking, when choosing a packaging material for plastic bags, it is a process from surface treatment to packaging.
Conversion: similar to the Contact process of the mesh frame, the Contact process is relatively non Contact process, and does not involve the connection process;
The speed of detachment is much greater than the distance between the copper surface and the hole, with uniform distribution of gaps between the holes, small contact area between the holes, and a certain degree of displacement of the edges of the holes. This is the purpose of a better detachment speed. However, in order to better solve the problem of copper peeling in wholesale sales, some manufacturers have suspended production in order to minimize the problem of lamination.
Engineers who have worked in engineering or material correction should not forget to replace certain materials quickly, so they need to reserve and replace them before making chip modifications. Our engineering team has more than twelve years of experience, and the engineers are also excellent.
I am also a senior engineering or R&D engineer in the industry, achieving international advanced levels in scientific research and technology accumulation. This has kept our products and processing quality stable, which has been unanimously recognized by our customers in recent years. Recently, our company has also obtained new orders.