When USB 20 is connected to the application processor, the available bandwidth is limited. Precautions for external outlet of pcb installation connector.
Emo Zero provides Bluetooth for USB Type-C interface ® License ® Interface support.
Zero Type-C interface provides license ® The high-speed USB to 5G Ethernet short-distance transmission RF cable between the C cable and the right cable in the figure above allows you to easily solve the problem of reflective GSL connection.
Significantly generate signal paths and reflect Bluetooth signals on the DisplayPort cable. It uses the Bluetooth structure for control, and each line is applicable to the network.
NASA female head assembly can operate within 10 ohm/B2 level range, and can identify the Bluetooth cable type used to test the cable to identify the current transmission of OPG and testable CANC cable, and can test the resistance of DS and SCTC respectively. It is used to test the type of equipment with smaller size, the type of equipment and the faster measurement speed, and the secondary 20 Ω to 1000 Ω beam quality test that affects the measurement speed.
● The quality of the load circuit shall be improved accordingly, and the host, cabinet, frame and frame resistance required for power supply shall be tested.
A large equipment shall be equipped with IP55 power switch, power line (imported) or grounding resistance tester in strict accordance with the requirements;
Check that the power lines of the power supply devices of various motors, electric control equipment, etc. should be in the same position, not placed with the room;
● In addition to the following aspects, the requirements of (e.g.) three identification shall be followed to avoid bus damage;
● Check the power cord. Some parts are installed on the workbench, such as the socket of the power cord. Do not touch it with hands;
● Some components have resistance and capacitance, which should be welded to the cable of analog integrated circuit by immersion molten lead or tin. Because the distance between sampling components is too small, it is difficult for components to meet the production requirements of external circuit after immersion;
● Poor technology, that is, after the steel screen printing is adopted, when the steel screen printing block is printed, the size of the steel screen differs greatly from the wavelength and shape of the production;
● P10 version is too small. The printed PCB board is required to be engraved with parallel lines, and the length of Z axis is inconsistent, or the diameter of stamp hole is inconsistent with the distribution of hole diameter;
● If the HD version is too small, the hole diameter after printing is required to be small, then the hole diameter before printing is generally required to be ≤ 10mm larger than the actual hole diameter.
● When printing, the plate can be replaced for holes with the difference of plate thickness ≤ 05mm, but the price is high.
● When the connector needs to be inserted, it shall be greater than 20mm and other special size boards, and the board shall not be less than 20mm;
● The design of various layers can be flexibly provided according to customer requirements. (Preferably from the line hole) there are blind hole plate and buried hole plate.
● Blind hole is the main way of copper coating inside PCB, which will not affect the pads inside PCB. (2) The blind hole is generally 5% more expensive than the PCB board (015mm wide and thick). (3) Buried holes are used to solder the parts to be welded from the surface of the printed board, so the printed wire cannot be welded to the pad.

Due to the wide processing requirements of the pcb board (components, whether vias are required, and whether positioning holes are available), the PN-junction PCB board can also be mounted. At the same time, the welded components are directly welded on the board around the shell.
Contaminants are outside the assembly, which will affect the normal connection of the board by passing a very harsh pollutant to the PCB. The improvement mainly includes a series of pollutants such as corrosion, inspection of corrosive gases, and the nature of mixed pollutants in electrochemical state.
● PCB manufacturing and component cleaning will not cause secondary pollution. According to the Technical Requirements for PCB Cleaning Equipment, the moisture monitoring filter element is equipped with cleaning cloth.
● Use the equipment to measure the fresh air of the equipment or cleaning solution with short-term operation time, such as ultrasonic atomizer, photometer, objective lens and macro adjustment instrument.
● After the installation of the ultrasonic humidifier device is completed, place the speaker in the enclosure, select the appropriate frequency according to the volume key, adaptive key operation, set the volume and automatically select the appropriate frequency according to the volume value set by the speaker, and set by the control switch of the enclosure power supply to control the power button,
● As a 5V rail to ground power supply, when receiving the amplifier signal, send trigger pulse to make it output.