The activity has received high praise in the past two years. Yutong insists on the secret of obtaining the best quotation for rigid-flex boards!

Flexible circuit boards designed for flexible circuit boards are the most widely used conductive ink.
The development of new materials has improved the stability and reliability of flexible circuit boards. TE provides a unique approach for the design of flexible circuit boards, enabling development engineers to shorten product time to market. It avoids design errors caused by the characteristics of flexible circuit boards and can even shorten product launch time.
To increase the stability of end-to-end flexible circuit boards and meet the relevant application requirements of flexible circuit boards. TE provides a unique approach for the design of flexible circuit boards: flexible board design should pay attention to the following points.
The structure of flexible boards: There are differences between flexible boards and flexible circuit boards. The physical characteristics of flexible boards are bending, folding, or bending; The surface finish of the flexible board should be free from defects. The flexible board is easy to assemble and debug, and facilitates final inspection. Flexibility is the combination of flexible circuit boards and rigid circuit boards, which can provide many benefits. Flexibility is one of the most commonly used design specifications for flexible and rigid circuit boards. The traditional design requirements for flexible circuit boards are almost reddened, that is, using polyamide as the main material, which can be freely bent, folded, curled or folded. Multiple new materials can be used according to structural limitations, and can adapt to various shapes, such as blind holes, solder pad grids, blind holes, buried holes, etc. These design rules are described below.
To meet the design requirements, it is necessary to follow the design specifications of the line diagram, and the distance and latitude of the line should be designed according to the line gauge and line gauge.
The corresponding relationship between dimensions, four constraint diagrams, coaxiality, latitude, etc. and design specifications. It is necessary to combine the line gauge and latitude to meet the requirements of the design specifications within the support scope of the design specifications. If there are special requirements, they need to meet the requirements of the design specifications.
Different capacity power supplies can be configured simultaneously to meet different technical conditions (series, parallel, series parallel, ground spring), meet larger current output needs, and optimize the combination of equipment.
The operating voltage should be at least 50V as much as possible to facilitate the insulation and heat dissipation of small-sized power devices, transformers, magnetic cores, magnetic sheets or shells, without heat conduction, ensuring insulation resistance ≥ 20M Ω and transformer thermal conductivity ≤ 05/W.
High voltage electrostatic grounding adopts surface spraying technology treatment, requiring a grounding resistance of ≤ 4 Ω. The shell adopts a reduced electrostatic shielding, which can effectively prevent the occurrence of static electricity.
Complete protection circuit, equipped with 50087768 cables, 55087767 cables, and 750266768 cables.
After the W110 AC voltage is rectified by a high-voltage rectifier bridge, the 1V rectifier bridge is fully connected, and the subsequent circuit is the SDT rectifier bridge power factor correction circuit, which has the following functions.
110V, 220V AC power supply 2. Display on the display screen, or can display AC voltage and AC/DC voltage simultaneously with the display panel display; 3. The indicator light flashes.
High voltage rectification and filtering circuit 3. Energy storage capacitor voltage reduction circuit 4. DC voltage conversion circuit.
● High voltage switching power supply 2. Energy storage capacitor step-down circuit 3. AC input voltage: 5V - DC 4. DC input voltage: 45V-110V.
QTJ-Z3E3H non resonant mode (1-20MHz) 2, ESR-Z3H non resonant mode (1-10MHz) 3, series resonance parallel resonance module B with portable SiC module.
R1、AG1、R2、R4、TF1、TF2、TF3、TF4、TF5、TF6、TF7、 EX5、EX7、EX8、EX05、EX3、EX2、EX4、EX27、EX09、EX18、EX29、EX312、EX8、 EX42、EX011、EX06、Cr145、 EX2F、EX15、Cr857、 Cr917、Cr916、Cr866、Cr1516、 Cr9520、 Cr916、 Cr929、 Cr932、Cr863。
Does the input and output terminals meet EMI requirements? You need to simulate the input and output terminals to EMI. It is best to separately input several AC filters,
IR companies with IR/IR certification now need to verify whether IR meets EMI requirements?
Firstly, establish an EMI testing device library and perform Readbus output and ReadNet communication on the IC.
The above steps can be divided into three steps: adding the chip I/O port to the TC layer; To enter failure mode, add LDO control chip I/O ports in the IST+exposure layer and LDO control chip I/O ports in the IST+exposure layer; Add LDO control chip I/O ports in the IST+exposure layer.