Errors may occur when making trial products by restoring metal plates. The development of rigid-flex boards is a mistake that we are prone to making. If the board is designed as a single-sided flexible board, the designer may feel uncomfortable with the design of a double-sided board due to the use of only a single adhesive, but it has greater thermal conductivity. The required adhesive is based on the design of a single sided flexible board using a mixed approach and following the main flexible design principles of MCM-1. Then, thicker adhesive and dielectric thickness are used to enhance the thermal conductivity of the circuit board. This structure is designed to handle the flexibility of thin plates and laminations, thus achieving a lightweight design.

The Microsolid coating should be symmetrical in its thickness direction, taking into account that sometimes users want a resolution of less than 001mm. The prominent advantage of choosing a coating is to ensure the uniformity of product thickness.
▲ Different coating materials should be selected based on the number of coating layers. ▲ l Thin film coating (PR).
If a welding layer coating is used, it can save about 3-4 times the surface tension and does not meet the above recommendations.
>>PCBA>>Coating layer (PR)>>Excessive moisture (moisture can cause flamelessness)>>Ensure that the PCB is effectively dust-free before curing.
To ensure the electrical performance and service life of PCBA and components, solder, packaging, and storage that have not undergone baking testing or testing have been requisitioned. In the finished product state, temperature aging should be carried out beyond the testing point, and the baking time should not exceed 2 minutes to avoid causing electrical performance failure.
Comprehensive surface treatment is evaluated through electrical performance testing methods tailored to different materials, environments, and applications.
Electrical performance testing can detect defects caused by poor solder or seal failure, which can directly affect welding quality.
Detect the solder layer on the chip, measure the solder points on the circuit board, and check if there is an open circuit between the chip and the chip's solder pads.

The insulation resistance of solder can be measured using testing methods. Different materials have different insulation resistance values. In some cases, the insulation value of the solder for the chip is higher at 870 degrees, in some cases, the solder joint for the chip is at 288 degrees, and in some cases, the solder joint for the chip is at 540 degrees. So when selecting chips, it is generally important to pay attention to the welding sequence. As the chip welding is to melt the solder to protect the solder metal, a tin lead or solder soaked melting layer is formed on the surface of the solder metal to form holes, and flux is separated from the metal surface of the solder, thus realizing the welding of high resistance flux.
A good solder joint can achieve good welding quality, so it is important to choose a good solder joint quality. For example, the quality of silk screen printing is better.
Printing, this process is now very common in technologically advanced countries. Ordinary screen printing machines can meet the needs of pattern printing, but screen printing technology has not really developed. With the development of screen printing, the selection of screen material and screen printing has gradually been phased out.