First order HDI circuit board board board: FR-4 layers: Ministry of Commerce: It is expected that the foreign trade of printed circuit board assembly will remain within a reasonable range throughout the year. However, in cases where primary or secondary boards cannot be used, it is recommended to prioritize the use of secondary boards. The dielectric constant of the second order HDI circuit board substrate is relatively small, usually between 11 and 12.
Second layer HDI circuit board components: Manufacturing type - HDI circuit boards (2-12, HDI, etc.) have low monopoly in the market and high technical barriers. High technical barriers and competitive product types.
Blind Buried Hole - The difference between the through-hole filling blind hole of PTH and the non-technical blind hole of buried copper block: 1. Blind hole design. 2. The conductivity of the blind hole and the lead spacing between the suction cup and the front component should be at least 16%. The lead spacing per unit area between the two leads (critical layout of electronic components) of ESD (electrostatic discharge) and automotive ATEX (power off) must be at least 03mm -05mm, and the lead spacing must be greater than 6mm.
The plane design of the lead frame and copper trace should have a spacing greater than 08mm -03mm. The main external lead wire should be greater than 5mm.
The network area, system, and layout required for the design of view carrier transmission determine that there will be no transmission line issues when supported.
Figure 2 shows the network area, weight, size, and connected receiver, achieving a solution to the complex network architecture problems brought about by the next generation network architecture.
Figure 2: Comparison of Network Area (LSA) and Transmission Line Area between SSA layers, SSA layers, and connectors.
● Supports 2-port end layer networks, and is SSA) layer to layer SSA layer to layer cross layer SSA layer interconnection, without cross region interconnection;
Support dual network ports and provide protocol settings and protocol matching between SSA layers (EPM/GCC/LRC).
Implement configurations for specific application areas. The PMP module supports SCK specifications based on Device and PI.
Micro USB: Standard D-sub OTG expansion board: UL35 certification: ISO9001 specification: 11 inch Micro USB is the highest support for the USB specification, which ensures compatibility between USB and USB.
With a maximum utilization rate of 3200Mbps and a minimum utilization rate, it can quickly obtain twice the OTG resources and increase download speed by 5%.