The above key equipment has entered the global leading manufacturing enterprise procurement system. How can the big data of rigid-flex board foreign trade be implemented in manufacturing enterprises?

The above key equipment has entered the global leading manufacturing enterprise procurement system. The rigid-flex board has a high speed all solid-state design, and can also be used for the design of bottom solid crystals, coatings, components, buried resistors, soft and solderable metals, components and devices.
● Production system management combines the whole manufacturing process, from industrial automation, power grid equipment, electrical automation, automation, servo, sensing, testing and measurement, machine vision, reflow soldering, machine vision, photoelectric industry, industrial machine vision, digital factory vision, industrial machine vision system, weldable parts, laminated ceramics, ceramic capacitors, inductors, magnetic beads, EMC/ECO, modules, components and PCB of the whole machine;
Several companies, such as Xunbo and other semiconductor equipment experts, have provided post-welding appearance inspection solutions and have conducted corresponding testing and verification; The post welding process includes wafer processing, post welding, wafer mounting, testing, finished product assembly, packaging, and other processes, as well as processes such as EMC/ECO/AOI, wave soldering, tin melting, and anti-static testing.
After the wafer processing is completed, the production process of the circuit board is already mastered. Before production, it is necessary to conduct simulation testing of all PCB prototypes on the circuit board and test whether the standard PCB meets production requirements. However, after the wafer processing is completed, it is only after testing whether the PCB is qualified that it is officially produced and used.
After tin melting, corresponding reference holes will be attached and tested to achieve a certainty of 1 million processes.
After tin melting, the corresponding reference holes are attached and tested to ensure the reliability of circuit testing, and ultimately to find no hidden dangers of copper open circuit or short circuit in the performance and holes.
Flux added to ICT test has different PCB X-ray and R-ray.
Moreover, the fixture design should avoid the contact surface of the probe pins and clean them in contact with PCB X-ray to ensure good welding quality.
The function of flux is relatively perfect, and it can also play a good role in soldering without coating the solder mask. However, if the pad is used for surface mount components, only black flux can be used to coat flux. If the flux is used on the thermistor, coating the allergic resistance will not play a role in solder resistance.
To prevent residual air from being sensitive to the usage environment, it is not recommended to use ordinary solvent cleaners. Due to the fact that a humid environment can cause an increase in humidity, it is easy to cause electronic components to short-circuit, burn, or catch fire. Therefore, the performance of solvents should be fully considered, and organic solvents should be selected correctly to avoid any safety hazards.
Volatile wet film is often used to bond to solar blowers. In order to avoid affecting cleaning accuracy, corrosion measures can also be taken to enhance ozone resistance. Therefore, this type of wet film has time to withstand, although it is usually at high temperatures, rarely encounters blowers, and is less prone to fire.