A virtual world that can interact with the real world, and a digital living space with a new social system. How big data in the rigid-flex board industry can change our lives.
Due to the advancement of flexible board preparation technology, the complexity of PCB manufacturing process continues to increase. Although the backwardness of the process has been reduced, there is still room for improvement, and it is expected that the PCB industry will usher in a new turning point and leap forward.

Electronic devices are constantly developing towards digitization, and PCB electronic components are moving towards smaller, lighter, and more complex directions. In addition, the new applications of automotive electronics and intelligence are inevitably driving the development of PCB electronic components towards high integration. The working frequency of electronic components is also constantly increasing, and PCB boards, as the carrier of electronic components, are also constantly developing towards high integration.
High density is known as the standard technology output platform for each laboratory, which can be easily used in conjunction with electronic experimental instruments or equipment connected to integrated circuit boards.
IC (Integrated Circuit), also known as integrated circuit, is an integrated circuit formed by a large number of microelectronic components (transistors, diodes, etc.).
Integrated circuits, which combine traditional individual circuits through components such as transistors and thyristors, form this masterpiece. Integrated circuits, due to their small size, low power consumption, fast speed, long lifespan, small size, light weight, high reliability, and ease of automated production, will be used to study the application of integrated circuits in micro robots, semiconductor equipment, intelligent equipment, and other manufacturing industries.
Silicon based MEMS converts analog signals and digital signals into interoperability signals, and simultaneously generates high-quality interoperability signals in the core structure. Mainly used in computers, capacitive sensors, RFID, switches, RFID, VR equipment, and industrial/medical fields.
Low power consumption. Its frequency in high-speed digital transmission mode has a clock frequency of up to 833MHz, so it can be seen throughout the entire audio range that there is a relationship between its frequency and low power consumption. It is the latest high-speed clock standard.
Different from traditional clock driven IC, MCU and other technologies. This requirement is advantageous in many applications for this type of clock.

The clock cycle can increase the switching frequency of the controller, from one chip to another chipset. This design allows experienced engineers to achieve ultra-low power consumption in a short period of time.
The output time of a clock can reduce chip level jitter, shorten the clock cycle, and save a lot of component costs. The hanging point of the clock is lowered to a chip level, and at higher clock frequencies, the clock moves from one chip to another chipset. For the second very high clock frequency, the clock ranges from a few chips to a chipset. This simple clock is most suitable for clock input clock 100 μ S. The second type of "TCL" clock with a faster clock rise rate than time is not suitable for expensive clock applications at high clock frequencies. For clock sources that can provide a higher level of performance for the entire clock, including input, output, or higher clock sources, as well as timing ratio to stop time.