1. Try to make the line pass each point in turn to facilitate the test, and the line length should be as short as possible.

2. Try not to route cables between pins, especially between and around integrated circuit pins.

3. The lines between different layers should be as far as possible not parallel to avoid the formation of actual capacitance.

4. Try to use straight lines or 45 degree dashed lines to avoid electromagnetic radiation.

5. Ground and power cables should be at least 10-15mil long.

6. Connect the ground cables together to increase the ground area. The lines should be as neat as possible.

7. Pay attention to uniform discharge of electronic components during installation, insertion and welding. Arrange the text in a reasonable position on the current character layer, pay attention to the direction, so as not to be obscured, easy to produce.

8. Structure should be considered when discharging components. The positive and negative terminals of the patch assembly should be marked at the end of the package to avoid space conflicts.

9. Currently, printed circuit boards are available for 4 to 5 Mil wiring, but are commonly used for 6 Mil wire widths, 8 Mil wire spacing, and 12/20 Mil pads. Wiring should consider the influence of injection current, etc.

10. The components of the function block should be put together as much as possible, and the components near the LCD should not be too close.

11. Through holes should be coated with green oil.

12. It is best not to place pad, overspace, etc. under the battery holder, and the pad and VIL are of reasonable size.

13. After connecting the cables, carefully check whether each cable is properly connected.

14. The oscillating circuit element shall be as close to the IC as possible and as far away from the antenna and other vulnerable areas as possible. The grounding pad shall be placed under the crystal oscillator.

15. Various methods, such as reinforcement and hollow element placement, should be considered to avoid excessive sources of radiation.