ADC conversion: Based on the actual needs of the product, choose the appropriate accuracy, and rigid flexible board products become the hottest choice.

Dy guide rail: The distance between Dy guide rail and Dy guide rail is relatively small at 05mm, and the distance between Dy guide rail and Dy guide rail is 05mm.
The distance between Dy guide rail and Dy guide rail ranges from 05mm to 18mm, which is composed of SMT automation technology.
Solder paste printing machine, also known as SMT printing machine, is used to print solder paste or patch adhesive, mainly used on electronic components. There are three types of solder joints: patch, plug-in, reflow soldering, and wave soldering.
With the increasing popularity of electronic products, solder paste has also become increasingly important. At this time, the use of solder paste in many electronic components is particularly evident in the electronics industry, which is the characteristic of solder paste and SMT chip bonding. With the overall upgrading of information technology in the electronics industry and the increase in component density on circuit boards, solder paste with lower precision requirements for solder paste printed boards and components has little application in the electronics industry, This is the technology used in the production and processing of SMT chip mounting. With the development of printing technology and chip mounting process technology, the requirements for solder paste printed boards and components are also increasing. It is mainly used for 0201, 0402, 0603 and SMT chip processing manufacturers in mass production, which will consider the process requirements of chip mounting processing and generally need to be used.
Printing process and SMT components. The printing methods include silk screen printing, glue immersion, cutting, sandblasting, post-processing, and mounting. After selecting appropriate equipment, the product must undergo semi-finished processing, and the specific processing process depends on two stages.
There are two manufacturing processes for PCBA processing, one using chemical solvents or organic solvents as the medium, and the other using advanced control and detection technologies. After all processes of the PCB board are completed, the PCB board will undergo warpage detection. How to detect warpage? Next, Chongqing printed circuit board Processing Factory - Engineer Master will share relevant issues regarding PCB board warping detection.

After reflow soldering, printed circuit boards need to be tested, starting from the highest layer of the PCB board and testing the welding quality of all layers