Its products and services have received unanimous praise from market subscribers. The market prospects for Electronic Manufacturing Services remain promising. Recently, a company named Micron (which can now eliminate the need for packaging of electronic products for any model on the market and has a strong demand to win the market through offline trade) introduced manufacturing experience in the field of Electronic Manufacturing Services and developed the world's first large-scale SMT production line. Micron's products and services not only meet customer needs, but also gain more recognition and market recognition. However, its products still retain many important features.
The materials will include components on the surface, so the packaging protects various components to ensure full automatic labeling under the packaging.
The soldering wire can be connected to the fixed position of the component by reducing soldering points, so that soldering can form another through hole.
After the assembly of electronic products is completed, SMT chip processing will provide PCBs, and SMT chip processing will complete production operations from component welding, appearance, and other aspects. The assembly process integrates complex sequential motion control and forms a complementary relationship with the DIP insertion technology integrated with through-hole insertion technology, ensuring the quality of electronic assembly.
The PCBA three prevention coating process includes immersion coating, brush coating three prevention coating (spraying), and immersion coating automation operation.

All covering films are first wetted on the surface, then cured, dried, and then coated with an anti reflective coating and a qualified inspection mark before coating.
The attachment direction of plug-in components should be free of deformation, corners, burrs, and other postal and telecommunications wires, pads, and pins.
When designing a PCB, shielded wires should be used for the power and ground wires, and should be kept as far away from high-power devices as possible.
At the time of PCB, other board names and interface circuits must be connected uniformly and cannot be separated.
When the detection switch is powered on, the power and ground wires of the PCB should pass the corresponding control system testing.
After connecting each detection switch to the sampler circuit, the output terminal of the detection instrument must be unscrewed. The test socket (connecting wire and terminal) screwed on the same side of pin 1 should be separated.
Before starting the detection switch test, the switch should be tested, and then the test seat should be checked for short circuits. Some switch test seats do not have a test seat, while others fail.
The test detection switch should be directly fixed with a test bracket in the detection lamp section to ensure the accuracy of the test.
● It is necessary to quickly and accurately detect switch action, such as detecting poor socket contact, replacing equipment for continuity, repairing coil inductance and capacitance, checking for coil leakage, checking for transformer breakdown, insulation leakage, resistance and transformer errors, etc., to determine whether the test switch is operating normally, and to indicate whether the switch is in the "on" state when not operating.