We are the most powerful electronic manufacturing service provider capable of developing and researching various large-scale electronic products.
A diversified electronic manufacturing service provider with a comprehensive after-sales service system provides you with complete product solutions. From EMS, PCB&PCBA, to EOL, PCB/PCBA, PCBA provides one-stop services, including electronic component purchase, PCB manufacturing, IC agency, etc. A supplier with high reliability and high quality, focusing on PCB and PCBA electronic manufacturing services, a true global manufacturing partner, providing high reliability and high-quality EMS, PCB and PCBA customized services to global customers.
Application fields: consumer electronics PCB, PCBA, TVnic, PCB, aluminum substrate, high-frequency board, thick copper plate, impedance board, high-end PCB, back drilling, etc.
The main choice of PCB board is to determine the rigidity and heat resistance of the material. It has high heat resistance (+180 ° C), low viscosity and high gloss (93 ° C), low CTE and low dielectric loss (+80 ° C), low CTE and ultra-low CTE.

Bare chip MCU technology includes: HBM2C1000 series, DMCTO-20B series, Protel 9-level series, Maxim ESD (421) series, ESD (1) NTC thermistor series.
Discrete resistor: plug-in high current 05A, plug-in low current 05A, and packaged with 05A, ceramic packaging 80%;
High precision: 0201~03mm; Over temperature: 150 ° C; Rated power: 200W; Flame proof: 30mW;
Chip resistance: 0805~1%; Ceramic packaging, high-frequency characteristics: 0402 packaging, 100% coverage.
Resistance range ± 10%~1 Ω; Leakage current ± 10%  Material sputtering (FL); Stamping, electroplating.
Electrical characteristics: high reliability; High stability; High air tightness; Long service life; There are no special requirements for electrical properties and leakage current during operation;
Optical characteristics: high transmittance; Wide field of view; Optical characteristics: Good optical characteristics; Optical characteristics of voltage and light; Impact and RF characteristics: high requirements for surface performance of materials such as glass and sapphire;

Glass fiber technology: It has the characteristics of wear resistance, high temperature resistance, creep resistance, good dielectric properties, enhanced thermal expansion coefficient, and multiple formula sizes.