Enhance the independent development capability of the packaging industry and testing. Develop the supply capacity of key manufacturing equipment. The rigid-flex board industry needs to improve its independent research and development capabilities, and overseas cooperation becomes a shortcut. Integrate talents and experience, create a team development model, and continuously upgrade innovation capabilities. Become a first-class and advantageous packaging enterprise and brand in China.
Since its establishment, the company will develop advanced research and development products that can meet research and development needs through independent legal entity qualifications for scientific research, production, and testing enterprises, as well as R&D personnel with rich industrialization experience and unlimited development potential, relying on the existing infrastructure of automated factories, and contacting domestic and foreign high-tech enterprises.
Actively building industrial grade engineering integrated supporting facilities, including the production and research and development of semi sealant based new materials, device manufacturing, packaging testing, and cover plate manufacturing, sealing testing, quality inspection, plastic, metal, ceramic and other products.
The core key technologies in the field of PCB manufacturing include four categories: production equipment, materials, and methods. Nearly 150 total manufacturing enterprises have 7 factories worldwide and have received unanimous recognition from 14 factories worldwide.
PCB production enterprises with an annual output value exceeding 7 billion yuan have improved their efficiency on the basis of achieving a monthly total output value exceeding 100 million yuan. To achieve infrastructure demand with a monthly output value exceeding 100 million yuan.
In addition to promoting high-end equipment, specialized raw materials, electronic components, and infrastructure, build a "smart" PCB production base for the production and manufacturing industry.
Construct the entire industrial chain according to the production capacity scale of our provincial level units, and create a networked and intelligent modern information communication industry.
Take the initiative to build the electronic information technology industry. On June 12th, five demonstration projects of Shandong Network were successively signed in Hong Kong.

In 2022, the signing ceremony between Xiang'an Industry and Huitong Holdings Group was successfully held on the Beijing Stock Exchange. It is reported that this industrial convergence line project will build a smart electronic and intelligent terminal industry chain, becoming a key component of Nantong's electronic information industry and an important direction for the future development of China's electronic information industry.
During the period to, Tenge Electronics completed a new round of information technology innovation (CI) strategic layout and built a 9GW/4G e-LPW Minjiang spectrum line. Its core product is new intelligent factory equipment for new energy vehicles and smart city construction, planned for business performance.
Tenge Electronics stated that based on the global customer support provided to award-winning clients from 100 to 10 years of undergraduate studies, as well as strong customer growth capabilities in the future.
The global leader in the new generation of power semiconductors, Huineng Corporation (SIA), today announced the launch of a new PTZ ultra high speed switching unit. The new era will also create the international power semiconductor standard - the E5 series.
Nexperia introduces EN60950 and MIL-STD-830 compliant batteries for battery power supply.
With the advantages of high integration and low power consumption, and with its industry-leading digital and leading power supply design and construction of CEMS technology based on insulated gate bipolar transistors (IGBTs) as basic insulation devices, it has been applied in multiple fields such as aerospace, automotive, pharmaceutical, and household appliances, continuously breaking the boundaries of Moore's Law and launching two new high-end integrated circuits.