After the overall project is completed, it can produce 3 million square meters of high-density printed circuit boards and 2 million square meters of flexible circuit boards annually; The latest prices of printed circuit board assembly have generally increased this year. However, as the demand for end customers upgrades, the research and development of new projects and production capacity increase, prices will relatively decline and become more time-consuming.
It is understood that in November last year, major electronic companies began to enter the field of flexible circuit boards through online means. Currently, most large domestic enterprises have started to enter the field of flexible circuit boards through online means.
At present, as Mini LED has entered a rapid development stage and its power and energy consumption requirements have become increasingly stringent, Mini LED has begun to enter the "fast lane". At the end of last year, major companies launched Mini LED products one after another. However, in the first half of this year, during the mass production phase, the popularity of Mini LED and OLED fields did not break through. However, by 2023, more new products were introduced, which was a major sword for the maturity of Mini LED technology. By 2024, the scale of OLEDs will continue to exceed 20-30% and continue to enter the "6+1" era. Mini LED technology will continue to be widely used in smaller, stronger, and more refined LED processes, providing a historic technological route for Mini LED breakthroughs.
Samsung Electronics, for its L150 ultra light semiconductor backlight product group, has signed an intellectual property funding plan with M LED chips and Samsung chip manufacturing equipment material manufacturer LCio this year, jointly providing funding for the project through active research and development partners who will carry out technological innovation in sputtering and integration, as well as the application of new processes.
According to Samsung, LCio has a dust-free environment of 4000 square meters, including sputtering targets, metallization integration, system level integrated circuits, and engineering level integrated circuits. It has "customized" products and "new designs", "RTL, and long-life silicon based CMOS" silicon based devices in the field of consumer electronics. The company also added that it is expected to produce 4-inch, 4-inch, or 8-inch silicon based devices this year. From the commercial development of high-performance and broadband third-generation semiconductor technology to the large-scale application of products in 2025, the company has exceeded $10 billion in operating revenue.
A leading, high-performance, low-cost, and low-power silicon based device product, the market achieved a revenue of $850 billion in the first quarter of 22 years of upstream exports. This quarter's net loss was 71%, with a total export volume of $261.4 billion and revenue of $120.4 billion.
The reason why the Tongyan Science and Technology Innovation Board can provide such analysis services is that Jingneng has a batch of ongoing projects for new CMI wafer and integrated circuit business at its sealing and testing base located in the CMI Park in Beijing, forming the second sealing and testing project in the country, which will also have an impact on the company in the future.
It is reported that a one-stop production base with CMI wafer and integrated circuit business has been built under this platform, including TSMC, Huahong, Texas Instruments, Tiankehe, ITRI, and others.