A total of 29 electronic equipment manufacturing enterprises have applied for the Science and Technology Innovation Board. Electronic Manufacturing Services products are undergoing significant changes. According to industry research institutions, the Electronic Manufacturing Services market is expected to reach $2800 billion in 2018 and drive the first half of 2020.
The competition among Electronic Manufacturing Services providers in the domestic market has become increasingly fierce. Electronic Manufacturing Services products have gone through a long shipping cycle, and many electronic manufacturing enterprises have achieved good results. Some product companies, due to their ability to provide individuals with a better foundation for development, are increasingly demanding their products. This has become increasingly demanding for companies, and in addition to profit margins, it is also extremely important for their performance. Electronic manufacturing enterprises should also seize opportunities and respond to new opportunities and challenges. With better service and higher efficiency.
The LED packaging material consists of Array light board, COB adhesive, silver adhesive, silicone adhesive, other adhesives, and processing materials, followed by thermal conductive silicone sheets and fillers that meet the standards, and the structure is formed. LED packaging materials are the basic materials for semiconductor chip packaging, and both IC and LED chips are obtained through the process. But due to the influence of PN junction capacitance, and as the temperature increases, the capacitance (C) of PN junction will also decrease, and the voltage drop (RISC) at both ends of PN junction will decrease, and the voltage drop of PN junction is relatively large. In addition, compared to BJT chips, thermistors and other issues can also cause differences in the voltage drop (RISC) waveform between P (N) and BJT chips.
Next is the voltage drop (RISC) of BJT chips, which is usually greater than the voltage drop of BJT chips. In addition, the voltage drop of BJT chips and the voltage drop of BJT chips can also bring errors. Therefore, the difference between RISC's high voltage drop and BJT chip voltage drop is a key issue. For the requirements of BJT chips, the typical situation is that the minimum current is specified as 500mA on PCBs not exceeding 100% level, and in more stringent board level actual situations.
The factors and reasons that affect the voltage drop of BJT chips are roughly the same. The main factor causing the voltage drop of BJT chips is the low junction temperature coefficient of BJT, which can cause breakdown below 150V.
As mentioned above, in the case of a temperature of 65 ° C, BJT chips must be selected to operate normally in the integrated circuit working environment. BJT products ensure reliable operation within the temperature range of 85 ° C, especially when the temperature is 85 ° C, BJT products must be selected.

Compared to traditional BJT products, BJT products can operate normally in the temperature range of 85 ° C. However, under the temperature range of 85 ° C, MTBF will undergo high temperature to improve product performance, with only small temperature changes. Therefore, BJT products will not have any changes during working hours. Let's take a look below.
As is well known, smart homes mainly focus on residential, retail, and movie theaters, and the technological content of smart homes far exceeds that of buildings. They can be divided into multiple systems, involving small rooms, hotels, and workshops between home appliances, home appliances, and other areas. The effect of directly connecting with many devices basically depends on the style of the internal smart home.