Responsible for learning and analyzing the packaging technology of similar domestic and foreign companies' products or new products, and analyzing the explosive path of printed circuit board assembly and new products.
Responsible for analyzing the explosive technology of domestic and foreign markets and materials industry products, and achieving breakthrough customer acquisition in electronic products and technology.
Responsible for analyzing the thermal effects of various automotive light sources, researching the importance of improving and improving the appearance and power performance of new car bodies.
Responsible for EMC related work on switching power supplies, as well as the development and certification testing of RF, microwave, millimeter wave, grating, Y interferometer, and other manufacturing equipment. Responsible for preparing standard testing, measurement, design, and inspection for various products. Including product structure, technical requirements, testing system, and application for IP standards.
MOS and YRF testing equipment involves testing, DC/DC, CV/CC, gate, source, transistor, resistor, diode, voltage regulator,+5V/4kV, pulse and pulse voltage testing.
The ADI (high-precision and high-voltage testing equipment) and CIV (high-frequency) testing equipment product series have various testing equipment and specialized products, including discrete devices, high-precision and SMT component testing, discrete devices (diodes, Schottky diodes, transistors, etc.), LTCC/LMM, ceramics, thin film packaging, etc. The testing equipment can achieve functional testing of discrete devices and integrated circuits, including integrated circuit ICs, packaged devices, and modules, chip inductors, RF inductors, resonators, etc., and LCORC SAW models. Simultaneously, one by one, through EXT_ Level 1 of LSI, combined with other functions such as over temperature and temperature sensors, is achieved through EXT_ IC design can assist customers in designing and developing the specifications you need, which is crucial. Please read and download during the experience.
Multiple RF/RF RF transceivers: Three types of antennas and antennas, combined with IP level main features for various applications, enable these wireless communication products to meet the provision of various RF signals, meet a wide range of technical specifications, and also help customers design RF/RF circuits.


Suitable for various applications such as WAN OF, especially for high-speed real-time RF communication, with high antenna requirements and BOM requirements.
The development work frequency can reach 500KHz, allowing RF system designers to not only create circuit diagrams, but also produce various analog and digital components packaged on the RF system,
Wireless Radio Frequency (RF) IC is a chip that unifies RF microwave and microwave circuits. In general, analog chips are circuits such as transistors, resistors, capacitors, etc., which are different from electronic components and all have RF characteristics. It is a crystal transistor manufactured using microwave technology.
The packaging of IC is the same as IP or PCB, but due to the definition of IP/ground, its packaging form is the same, and all types of IC can be called chip packaging IC.