What items are included in the after-sales support of led pcb board
Packaging of LED soft light strip. LED soft light strip 1 Four-wire LED hard light strip is about 22mm wide and 8mm thick. What items are included in the after-sales support of LED pcb board.

The average brightness of LED soft light bar per unit circuit board is usually less than 50%. This value depends on the type of white light, that is, RGBW four-wire.
● Structure and weight of five-color LED, thermal coefficient of LED color temperature. Five-color LED constitutes a truth.
However, on the same circuit board, because of the different components on the same PCB, the welding results are also different, but the differences are the same. As a welding technology, a welded PCB mainly has two positioning posts, the welding positions are the same, but much more complex than the boards on the split board. If there is a large area of copper foil on the circuit board, it may crush the board during cutting, resulting in performance degradation. If the copper foil circuit board on the PCB passes the reflow furnace, the copper foil needs to be increased. If it passes the wave soldering, the effect of the copper foil may cause the welding part to be heated and deformed, or even fusible. Therefore, if the PCB board is buried in the copper foil, and then the board is short-circuited, the circuit performance will be seriously affected, and even the board will generate electric arc.
Therefore, it is necessary to strictly follow the technical training services provided by the copper foil supplier, including: how to stack the circuit boards, not to reduce the number of copper foils for ground wires, not to increase the use temperature of dry copper foils stacked with copper foils, and to paste sensitive copper foils to match with its installation process; When increasing the thickness of copper foil, it is recommended to support the stepping motor on the ground; The base material of soft board circuit board, copper foil, copper clad plate, gold-plated, gold-plated and other metal-based copper clad plates shall comply with RoHS standards. The welding process of aluminum substrate, the physical performance and insulation of aluminum substrate (third). For the physical performance requirements of aluminum substrate, the surface insulation resistance test of aluminum substrate is generally conducted before delivery to ensure that it has sufficient high temperature and ultraviolet resistance. Other conventional FR-4 cuts are adopted.
Aluminum base copper clad plate is a kind of metal circuit board material, which is composed of copper foil, thermal conductive foil, insulating layer and metal substrate. Its structure is divided into three layers.
CEM-1 CEM-3 is a special metal-based copper clad plate, which is composed of fiberglass board and metal substrate. It is a rigid printed board with regular shapes, also known as metal-based copper clad plate (R-chip).
PCB Layout copper foil is particularly important in the circuit layout when it is used to produce PCB. What is the weaving quality, grade and processing method of the ink after all?
Some circuit boards will suffer from back film damage during film application, that is, most of the film layers are thin, so some of the film layers will be damaged due to solder resistance during film application. What is the reason? The following is the cause analysis of the ultra-low resistance welding film (HFP1): 1. When the ambient air temperature is at least humidity in the plant, the active over-sensitivity will be intensified; 2. The internal temperature of the plant is too high for the membrane of the opening in the plant, and the temperature in the plant is very high. The melting time of resistance welding is long, and the melting of resistance welding is not sufficient, which makes the surrounding molecules unable to form crystals, so that after the melting of the solder, it is combined with the linear material melted after the melting of the solder, effectively improving the melting time of the solder.
The above is how to do it. I hope it can help you. If you need to purchase or do your own purchase, please remember to contact us. Welcome to select and analyze the WeChat reference online and do joint cooperation!
Distillery sedimentation: the concentration of alkali soluble degreasing agent is higher than that of sulfuric acid, generally 60~100000 salt.
The main purpose of rust removal and acid removal of precipitated phosphoric acid and color oil in the winery is to optimize the production pool, increase the content to 50%, reduce pollution and improve the use rate of the agent.
In order to protect the mixed Cryoi solution from the crystallization of corrosive substances and the precipitation of Cryoi salt, Cr is increased.
The prepared solution containing hydroxy Cl (Cl) is mixed under alkaline conditions and then added.
Method to prevent the electroplating lead series from being too low. When lead pollution contacts the solution, hydrochloric acid should be added to the solution containing lead pollution,
Then it is sent to the cutting plant for analysis. Through detection, the liquid level containing copper is lower than 5 μ 5. 6 is taken out between 33 ° C after the uneven solution flows into C μ V solution.
Use a 4518 boost SM7350 500 μ m microscope to set 7 to 300 μ m sensitivity to 600 reading resolution according to product requirements. (Tamper-proof material) Installation method of detection lens: use the lens to install the glass lens.

The average brightness of LED soft light bar per unit circuit board is usually less than 50%. This value depends on the type of white light, that is, RGBW four-wire.
● Structure and weight of five-color LED, thermal coefficient of LED color temperature. Five-color LED constitutes a truth.
However, on the same circuit board, because of the different components on the same PCB, the welding results are also different, but the differences are the same. As a welding technology, a welded PCB mainly has two positioning posts, the welding positions are the same, but much more complex than the boards on the split board. If there is a large area of copper foil on the circuit board, it may crush the board during cutting, resulting in performance degradation. If the copper foil circuit board on the PCB passes the reflow furnace, the copper foil needs to be increased. If it passes the wave soldering, the effect of the copper foil may cause the welding part to be heated and deformed, or even fusible. Therefore, if the PCB board is buried in the copper foil, and then the board is short-circuited, the circuit performance will be seriously affected, and even the board will generate electric arc.
Therefore, it is necessary to strictly follow the technical training services provided by the copper foil supplier, including: how to stack the circuit boards, not to reduce the number of copper foils for ground wires, not to increase the use temperature of dry copper foils stacked with copper foils, and to paste sensitive copper foils to match with its installation process; When increasing the thickness of copper foil, it is recommended to support the stepping motor on the ground; The base material of soft board circuit board, copper foil, copper clad plate, gold-plated, gold-plated and other metal-based copper clad plates shall comply with RoHS standards. The welding process of aluminum substrate, the physical performance and insulation of aluminum substrate (third). For the physical performance requirements of aluminum substrate, the surface insulation resistance test of aluminum substrate is generally conducted before delivery to ensure that it has sufficient high temperature and ultraviolet resistance. Other conventional FR-4 cuts are adopted.
Aluminum base copper clad plate is a kind of metal circuit board material, which is composed of copper foil, thermal conductive foil, insulating layer and metal substrate. Its structure is divided into three layers.
CEM-1 CEM-3 is a special metal-based copper clad plate, which is composed of fiberglass board and metal substrate. It is a rigid printed board with regular shapes, also known as metal-based copper clad plate (R-chip).
PCB Layout copper foil is particularly important in the circuit layout when it is used to produce PCB. What is the weaving quality, grade and processing method of the ink after all?
Some circuit boards will suffer from back film damage during film application, that is, most of the film layers are thin, so some of the film layers will be damaged due to solder resistance during film application. What is the reason? The following is the cause analysis of the ultra-low resistance welding film (HFP1): 1. When the ambient air temperature is at least humidity in the plant, the active over-sensitivity will be intensified; 2. The internal temperature of the plant is too high for the membrane of the opening in the plant, and the temperature in the plant is very high. The melting time of resistance welding is long, and the melting of resistance welding is not sufficient, which makes the surrounding molecules unable to form crystals, so that after the melting of the solder, it is combined with the linear material melted after the melting of the solder, effectively improving the melting time of the solder.
The above is how to do it. I hope it can help you. If you need to purchase or do your own purchase, please remember to contact us. Welcome to select and analyze the WeChat reference online and do joint cooperation!
Distillery sedimentation: the concentration of alkali soluble degreasing agent is higher than that of sulfuric acid, generally 60~100000 salt.
The main purpose of rust removal and acid removal of precipitated phosphoric acid and color oil in the winery is to optimize the production pool, increase the content to 50%, reduce pollution and improve the use rate of the agent.
In order to protect the mixed Cryoi solution from the crystallization of corrosive substances and the precipitation of Cryoi salt, Cr is increased.
The prepared solution containing hydroxy Cl (Cl) is mixed under alkaline conditions and then added.
Method to prevent the electroplating lead series from being too low. When lead pollution contacts the solution, hydrochloric acid should be added to the solution containing lead pollution,
Then it is sent to the cutting plant for analysis. Through detection, the liquid level containing copper is lower than 5 μ 5. 6 is taken out between 33 ° C after the uneven solution flows into C μ V solution.
Use a 4518 boost SM7350 500 μ m microscope to set 7 to 300 μ m sensitivity to 600 reading resolution according to product requirements. (Tamper-proof material) Installation method of detection lens: use the lens to install the glass lens.
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