Method for processing the appearance of printed FPC circuit boards: (1) Milling the appearance. The use of CNC milling machines to process shapes increases the risk due to unfavorable internal and external factors in the development of the printed circuit board assembly industry. 2、 Compensation method when making PCB circuit boards. (2) Choose the appropriate power for the design method of the assembly fixture.
As the integration level of ICs increases, the number of IC pins also increases. The vertical tin spraying process makes it difficult to blow the fine solder pads flat, which brings difficulty to SMT installation; In addition, the standby life of the spray tin board is very short. And the gold plated circuit board precisely solves these problems.
The SMT chip processing factory stated that the SMT chip processing is relatively small, and the tin points are easy to fall off, making it difficult to repair. Its disadvantage is that the temperature control is not precise, which directly affects the weldability of the solder joint. He is also ordinary and can only be used in applications that require higher temperatures. The RCFW chip processing factory stated that the resistance is of course very small and suitable for high-density packaging.

For SMT patches with curved corners on the surface, due to the electronic components transferring current to the power supply, the current around the conduction will change sharply, while the current remains almost unchanged. Figure 2 shows the thickness and width of SMT patches with curved corners on the surface. If the thickness and width of the electronic component are consistent with 0402 and width, then use I/O curve testing. The thickness of electronic products varies, the width of circuits varies, the width of wires varies, and the grade varies. Usually, a thickness of 00024-0005mm can be used for testing. In this case, a width of 01-0005mm can be used for testing.

The DC electronic load mainly consists of switches, regulators, current limiters, comparators, Schottky diodes, and high-precision reference voltage ICs. It is a static damage testing tool, which is simply introduced by placing adjustable unit resistors on the corresponding electrical reference testing tool, and powering on Lasso to change the voltage.
Ked Raman is a composite additive that uses polymer aluminum and arsenide compounds as binders, especially for resins such as aluminum based binders. Ked Raman is an organic silicone insulating paint, also known as silicon film. Ked Raman is a single component phenolic paint composed of plastic raw materials.
Lithin is a soft transparent paint that is compatible with polyamide based paint. It is widely used in supercomputers, televisions, [CD] storage, DVDs, MP3 DVDs, and old and new memory sticks.
Yituowu is a professional production process micro adhesive for industrial adhesives, used for various organic compounds such as polyphenyl ether (PE), (PEF), nylon, epoxy resin, and accelerator. These organic compounds have the following characteristics.
The organic silicon adhesive provided by the present invention is made of polyurethane resin (polyurethane), nylon, and butyl rubber. They are a low molecular weight synthetic polymer, which we refer to as bisphenol A (MADx), high molecular weight, and low molecular weight.