The General Office of the Henan Provincial People's Government has announced the establishment of a "dual length system" for the key industrial chain of provincial-level advanced manufacturing clusters, as well as Japan's adjustment of the rigid-flex board industry chain. (@ Pengpai News WeChat) 1 Policy Interpretation of "Provincial Investment Promotion Work for Soft Board Factory".
The development of next-generation LED packaging and related technologies, as well as automation technologies, and their impact on the LED packaging industry.
Next Generation Power Device Packaging Application Technology (@ nf) Next Generation Power Device Packaging Application Technology (@ nf) Next Generation Power Device Packaging Application Technology (@ nf) Next Generation Power Device Packaging Application Technology (@ nf) Next Generation Power Device Packaging Application Technology (@ nf) Next Generation Power Device Packaging Application Technology (@ nf) Recent Discovery of 8-inch Silicon SiCs MOSFETs (@ nf) More than 8-inch High Voltage Device Packaging (@ nf) The third-generation SiC MOSFET power device packaging will continue to be available for several years, even driving the growth of SiC in this market.
As a leading supplier of power design tools, ASIC is continuously developing high-precision power management solutions with development technology as the main focus, thus having the highest level of technology in the industry.
Infineon is an early company that started in the IC field, and ST Company's intention is to have the advantage of low requirements.

Stable: Power supply manufacturers have high confidence in their intentions from domestic IC design companies.