It is expected that the market size of high-frequency printed circuit board substrates will reach 7.6 billion US dollars by 2022, with a CAGR of over 115%. Who is more cost-effective in the printed circuit board assembly market.
In the high-end field, it is expected that the proportion will reach 102% this year, and the proportion of composite substrates is estimated to be about 10%.
Of course, there are also some sub areas that lie in other fields, such as thermal control thermal conductive substrates, optical communication thermal conductive substrates, and PCBs, aluminum substrates, etc.
For products such as semiconductors and memory, it is expected that many advanced process chips will still rely on imports for a long time when downstream demand does not exist.
Therefore, with the development of electronic products towards people's "high-density", new technologies will be applied in chip packaging technology, chip flip chip packaging technology, high-density QFP packaging technology, and other aspects in the future.
On the contrary, during the Global Semiconductor Integrated Circuit Industry Summit in the early 20th century, mainland China will dispatch multiple experts from the front and back to conduct meetings on wafer production, packaging and testing, and conduct in-depth discussions and discussions globally. Due to the advancement of semiconductor technology, Taiwan's microelectronics technology and wafer factories in Taiwan have become battlefields for major semiconductor manufacturers, and wafer factories still have absolute confidence in this market.

Furthermore, the investment in the industrial ecosystem of wafer factories has led major manufacturers to invest in expanding production and assisting in the supply of storage chip business groups. The core participant is Microsemi from Taiwan's wafer fab, which is a major customer in the field of mobile display memory. The addition of a large number of orders has also made it more difficult for the company's operating performance to suffer losses.
Nowadays, wafer fabs have become the world's largest state-owned private enterprises that receive the most attention from downstream customers (such as electronics and electrical engineering, agriculture, heavy industry, consumer goods, etc.). By integrating the surrounding areas of the factory, business channels, and driving the upper management, they effectively integrate the advantageous categories of export and exchange orders, linking the "5% -10%" project investment as the main focus, and integrating wafer fabs with international and national industrial chain resources based on their own strength, Having advanced technology and operational models, able to rely on national strategies to implement and promote technological iteration in its own technological research projects, possessing unique technological and process development advantages. It has strong technological and technological advantages in the field of improving new generation consumer products and innovative research and development applications of new technologies, and can meet the comprehensive needs of enterprises and industrial technology.
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