PCB, abbreviated as printed circuit board (FPC), is translated as "flexible circuit board". Currently, foreign trade enterprises of printed circuit board components face four prominent difficulties.
The thickness of copper foil has a low impact on the testing tension, usually ranging from 10mm to 10mm. 2) During the test, the copper foil is covered with a height of 1mm to 2mm on both sides to measure the tension. 3) Because the test line is too long to absorb tension, and the adhesion on the substrate is insufficient, the thickness of the medium is controlled within 1~10mm in order to reduce the relative tension between the measurement point and the Test point. 4) For non-destructive small chips, proprietary drive systems or soft drive systems should be used to drive them, so that the measurement circuit is also smoothed out. 5) For example, various flying needle type gratings, high-strength wedge steel heads, and a large number of non ductile wedge steel heads (rubbed on rotating surfaces) are named after them. For silicon grinding tools or crystal silicon wafers, these devices can be reversibly lowered. These devices can also be controlled by transducers that move in sliding or vertical trajectories to control the cooling rate.
; Circuit board integration, double-sided board: SMT chip type two sided plug-in Wuxi/spray tin; Double-sided board: ordinary double-sided cutting, 1P bonding, double-sided board cutting, 1. Solderless crimping: 1. Surface treatment: gold sinking, tin sinking, tin spraying (with or without lead), normal passage, through hole, can be drilled and inserted freely, millions, aluminum, etc; Hole edge+all green oil+OSP, all gold plating, all gold tin, etc; Processing technology: general plug-in components, SOP, DIP plug-in electronic components; Commonly used plug-in components. Hot air leveling Product Type-c, buried electrical metal, double ring, second ring, three wave, four cap, etc; Gold plated BGA plug-in board; Sink gold PCB board.
The top ten electronic component distributors globally, such as Huakexin Agency, Afinv, TI, ON, MOS, etc. List common brands: TI, ON, NXP, ON, Maxim, Altera, Hynix, IR, ON, VISHAY, TOSHIBA, HITACHI, MCU, etc.