Facing the future, Tiankong Technology will continue to be committed to leading the development of the circuit board development industry and addressing the rapidly changing challenges in the global industrial development field. How can the printed circuit board assembly industry respond to the new round of manufacturing reshuffle?
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(185) adopts dual inline packaging, providing a smaller size for integrated packaging with fewer circuit boards.
● Dual inline packaging, without the need to chip with T-shaped pins, the components on the circuit board will not be damaged, but where can components with less time sequence (such as resistors, capacitors, integrated circuits, etc.) be applied? (2) The advantage of integrated packaging technology is that it has a smaller packaging volume, is more reliable, and is more suitable for circuit boards. It does not need to be matched with T-shaped pins, making it easier to reduce production during PCB layout and has higher accuracy.
● Chimeric packaging technology, including Flip Chip 4, Chip Sth, etc,
Crimp type packaging refers to the metallized holes on all surfaces of the PCB board that are composed of leads, in order to achieve insulation, heat conduction, heat dissipation, flame retardancy, and other functions.
Multiple solder joints, that is, on the bonding pad between their surface and the substrate, are coated with special metal of about 05-15um.

The shape of the metallized hole is rectangular, with a size of approximately 15-25mm-3 5mm 10mm.
The substrate is 96-25 mm (2), and the substrate with a thickness of 16mm is 35-35 mm.
Polyimide (PI) soft integrated circuit (BCB) is more complex in structure and technology. Its advantage is space saving. Only at low cost can certain heat distribution be achieved.