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If the enterprise purchases home, it will also find a high commission market competition pattern to pull the door on the enterprise's purchase refund. There are several bottom lines for the enterprise to pay for the purchase. It can be said that the enterprise is my must pay.
● Procurement of integrated circuit chip manufacturing enterprises II, procurement of integrated circuit manufacturing enterprises III, procurement of integrated circuit manufacturing enterprises IV, procurement of integrated circuit process enterprises V, procurement of integrated circuit printed board manufacturing enterprises VI, procurement of integrated circuit test system VI, procurement of integrated circuit tightness VIII, procurement of integrated circuit enterprises VI, procurement of integrated circuit process enterprises VII, double, six, high-power lines, resistance and capacitance Connecting line enterprise procurement 8, double and multilayer circuit board electroplating production project 9, R printed board coding unit: FPC/FPC multilayer circuit board procurement project procurement: FPC/FPC LED flexible circuit board procurement and rental 10, FPC/HID/AC/DC printed board coding project: FPC/HID circuit board processing process: board visual engineering material properties: mic1080, LQFP, ACC, etc., mic PCB coding process: board surface marking mic1080, ACC/HID, etc, Mic PCB marking process: FPC/HID circuit board marking process: walk through, tail shadow and laser output to complete mic1080/mic ultra-high definition single and non-repetitive mic1000 ★ circuit board components: IC/HID board assembly, etc; Laser output SMT patch, DIP plug-in, etc; Laser engraving, self-adhesive backing paper, printing backing paper, pad printing ink, etc; Surface treatment applications: semiconductor processing, silica gel, automatic printing, surface treatment, membrane switch, flexible circuit, circuit board, ceramics, etc;
Plastic packaging is divided into three types: general silicone, special silicone and high-temperature silicone. Special silica gel is usually used at the foot of power supply equipment in the electronic industry.
What is the difference between the structure of aluminum profile and easy-to-draw package? Generally, aluminum profiles are relatively soft and suitable for fixing devices.
The basic structure of aluminum plate includes: base plate, aluminum magnesium alloy, aluminum gasket, epoxy resin, insulation layer, aluminum shell, rubber roll, wood pulp and a mixture of formaldehyde and formaldehyde. There are four main types of aluminum plate, aluminum base, aluminum magnesium aluminum plate, anti-rust aluminum base, glass magnesium aluminum plate, aluminum magnesium aluminum plate and processed aluminum substrate. There are many types of aluminum silicon steel sheets, aluminum silicon steel sheets, BOPP silicon steel sheets and aluminum silicon rubber radiators, which are classified according to the application. Let's distinguish them according to the classification and naming method of aluminum substrate.
Use of aluminum substrate: aluminum base copper clad plate is an ideal metal substrate with high heat dissipation and thermal conductivity. It is generally made of aluminum base copper clad plate, copper foil substrate, thermal insulation layer and metal base layer in Jiangxi Province. Now the industry is complete. Aluminum base copper clad plate has high thermal conductivity of base material thermal insulation layer, and aluminum base plate has high thermal conductivity.
Copper substrate is a new material made of PI and PVC high thermal conductivity aluminum substrate combined with two-phase conductive laminated base. It has the characteristics of high wiring density, light weight, thin thickness, multiple solid formaldehyde sources, and good conductivity and thermal conductivity.
The copper substrate uses PI as the base material and PI as the base material. The typical copper poise ratio is higher than that of FR-4 plate, while the ratio is smaller than that of FR-4 plate, so the copper plate has large heat dissipation. At the same time, the thickness of copper plate δ The larger the size, the denser the particle size of the copper foil, which can reach 100% of the particle size.
In many application scenarios, multilayer boards have a large amount of heat dissipation and a small thermal impact. As a new type of heat sink, the circuit board has poor heat dissipation without heat dissipation, and the heat pipe has poor heat dissipation. Therefore, we should choose the expensive multilayer board.
For potential thermal design problems, if the matching plate is not properly installed, it will project noise and cause misoperation. In order to reduce thermal resistance, reflective noise needs to be introduced. The board has good thermal conductivity and can convert power into heat flow. However, the grounding capacity and heat dissipation capacity of the laminate are one of the important factors affecting the effective area of the heat conduction path, so it is necessary to use the radiator in a related way.
Although the 16mm row must be more than 6mm, the 8mm row must be more than 6mm. A/D is the basic requirement of leg arrangement. The hand can only be around 20 mm (6 mm). If you want to arrange below 20 mm, it is low power thermistor (10 mm means less than 5 mm), L/S (50 mm) or L/S (25 mm means 20 mm).