● Printing: This is an unnecessary component, mainly used to mark the names and location boxes of various parts on the circuit board, and the layout of this printed circuit board assembly subdivision field is gradually becoming a trend. The manufacturer must clearly see the part name and location box, so the location block diagram of these components can be said very clearly. Manufacturers should use it correctly with companies that can manufacture parts according to the flux of this segmented field. All components should comply with this feature in order not to affect performance and ignore it directly. This category is also known as the entity selected by the board of directors when releasing new products.
They are the next door to a few active components, due to the increasing size of technology transfer components, the volume of each component also decreases, and the chip size also decreases as the size increases. For example, if specific component sizes need to be considered simultaneously, the project can now reach several million dollars, depending on which component will give it potential time value. These components or their insider signals enable us to create sub components that can be downloaded in real time, consistent with their settings, the size of the participating points, and their computational geometry.
Generally speaking, to reduce the transmission impedance of signals, power lines, drive cables, etc. need to increase the signal path area and circuit grounding layer, improving the predictability of the entire system.
From the perspective of its penetration requirements, the connection between lines and networks not only requires the use of tear drop filtering for power supply, signal lines, delay, etc., but also requires the wiring of other electronic components such as isolation to be wired with 45 ° broken lines or 45 ° broken lines, and the total length spacing should not be less than 066mm.
The number of control signal wires cannot exceed 1 pair, as wiring issues can cause mutual interference between electronic devices. Electromagnetic induction filtering and current stabilization often generate self-excited oscillations. Moreover, because the frequency of the AC power transformer is 1000MHz, the ripple coefficient is 01.
The attenuator adopts high-frequency and low-temperature drift welding, which should be carried out between 0 ° C and 50 ° C, and is fixed with copper material. The connection holes at the bottom of the aluminum shell and between the casings and the mechanical contact between the iron bars should be increased.
★ Guide rail installation method: The slide rail module structure we adopt is based on the vertical guide rail, and is connected between the metal and aluminum plates using card slots;
★ Rail installation method: Consider installing pneumatic components inside the casing to protect the casing from atmospheric impact and collision.
★ Guide rail installation method: The main consideration is the axis diameter of the casing. When installing, use your hands to directly contact the surface of the casing. Therefore, the installation guide rail clamp rail should maintain a good fit with the casing, and there is no need to worry about the tilt and vibration of the support point contact.

★ Guide rail installation method: It is set during processing and installed with a rigid motor bracket to ensure firm and reliable operation.
★ Guide rail installation method: located below the metal chassis installation screws, and fixed again after installation.