LED splitter, pneumatic splitter, fully automatic splitter, and a comprehensive list of rigid and flexible board industry analysis institutions.
Check whether the gap between the finished product and PCBA is greater than 10mm, and pay attention to whether the parts have the same direction in the same direction.
Before the SMT chip processing factory ships, the PCBA processing factory needs to bake the PCB board, as high temperatures can damage the SMT circuit board. After the PCB board is baked, due to its own temperature change, the coefficient of thermal expansion of electronic components decreases, and the SMT chip processing plant will have problems with PCB board heating slightly. The warpage of PCB boards in SMT processing plants can also cause a decrease in PCB board bending. When installing the PCB board into the fixture, if the PCB board's warpage exceeds the standard area, there will be insufficient PCB board warpage. The spacing between components is too narrow, resulting in insufficient solder joints, and the components are prone to cracking and falling off, ultimately resulting in inability to weld; If the curvature of the PCB board is less than the standard area, the PCB board cannot be welded and the circuit board is deformed. PCB boards generally use IP components, and the requirements for PCB board warpage, flatness, and warpage will be relatively higher, and it will also affect the overall reliability and other parameters of the finished product.
● PCB board waste: If there are BGA chips, IC chips, QFP chips, shielding films, etc. that undergo wave soldering, and most PCBs are deformed, have multiple pins, bent, notched, etc., the waste can be solved through wave soldering.

Severe short circuit, open circuit, and other issues. It can cause adverse problems and affect the service life of the machine.
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