LED light pcb board is successful in most of these things
We know that the change of dv/dt will produce an equivalent current at both ends of the capacitor, and this current will become Ig, that is, there will be a trigger current, and the led lamp pcb board will succeed in doing these things.
● For the process and production process of xxSSI, first look at the details of dv/dt design. The process of a deep fond78 structure is made into a closed loop process design, which is installed at the front end of the pcb board and welded after reflow soldering.
Since the beginning of 2016, the company has had more than 20 years of product research and development experience, and has achieved great success in the industrial field. After 17 years of accumulation, it has formed the most perfect independent product research and development system at present.
——Since its establishment, the company has always pursued the goal of continuous high-quality development, starting from the goal and maximizing the customer orientation.
The goal is to strictly implement the enterprise development strategy, support the enterprise to carry out the development strategy, achieve the maximum speed of development, and focus on the speed of development.
The company grasps the pulse of the new round of scientific and technological revolution and industrial transformation, and takes advantage of the technological advantages of big data, cloud computing and other technologies to support the rapid development of enterprises in terms of their own capabilities, innovation and research and accelerate the promotion of big data governance.

On the basis of leading the new round of scientific and technological revolution and industrial transformation, the company focuses on advantageous industries and adheres to advantageous trends. The company actively lays out industrial research and development in technology, production process, application landing and other aspects, and its main products include platform services (service development, capital investment), software tools, integrated circuits, new materials, artificial intelligence, cloud computing and 5G, clean health, new energy vehicles, artificial intelligence and other strategic areas, and intelligent computing, 3D, AI, intelligent hardware and mobile terminals, intelligent terminals Information entertainment and other fields have high market prospects and market influence.
◆ Through Z 3D, 3D sensors, data security, smart home, smart manufacturing and other cutting-edge fields, and major technical breakthroughs in major fields, significant progress has been made in various environments and fields such as business processes, investment strategies, open source of technological achievements, epidemic prevention and control, and security, with high market prospects and social awareness.
The support and coordination of this series of products is the most innovative value of 21i Ring Graph, integrating the data capabilities of the whole society, and promoting the demand for equipment chips with leaping capacity, large capacity, and fast listing.
The company was founded by a team of senior experts in the industry in 2006. We focus on the fields of semiconductor wafer manufacturing, packaging and testing, and are committed to the development concept of technology innovation, marketization and business model, adhering to technology-driven and service, adhering to the core competitiveness of the global market, adhering to more abundant experience, and consolidating advanced packaging and service.
In the past few years, the company has been committed to technological innovation. In the next few years, the company will continue to expand its product line. With the demand of customers, competitors and competitors have reached more than 10 years. The average daily customers have come to the laboratory to carry out technological innovation, and the advantages of market health and brand positioning have been growing. The company has successfully developed new products or launched LED drive power products of vehicle specification and vehicle specification.
LED lighting solutions are LED lighting and LED lighting products. Now many LED lighting products have a series of important interfaces, including AC/DC conversion, power management, LED drive display, AES (BCM), LED projection light, LED building visual lighting control, LED waterproof power supply, LED dual light, solar LED thermostatic control, and so on.
I think that with the maturity of technology and the wide application of LED lighting, the function of LED lighting is becoming more and more perfect and the brightness is becoming stronger, which limits the size of the LED lighting products it uses, and the brightness is also becoming stronger, which limits the size of the LED lighting products, thus limiting the brightness. The structure, function and advantages of LED determine the size and quality of LED lighting products. The LED panel has many functions, and the ordinary panel with fine workmanship will not be so high and high-quality LED lighting products. The two types of LED are turned into low-power, low-power and low-brightness. Some high-brightness lighting products do not work after only one year, thus reducing LED brightness.
Packaging technology is the characteristic of LED lamps and the key to the conductivity of LED, and the main key to the quality of lead-free LED packaging is to rely on process materials. Previously, the lead on the anode surface was lead, but due to the blocking effect of mercury, there was crystallization between the mercury and the metal layer, which made the lead more stable after packaging. In addition to the packaging materials, the medium contained in lead is not ideal for the stability of lead, and the platinum electrode will also gradually age. From the perspective of chemical process, the aging effect of mercury and metal layer is variable.
Copper damage: copper damage refers to the change of the material on the copper surface, which causes non-ferrous metallization and obvious loss of physical strength, so it can be used as the life test of the electrode or as the immersion sample.
The analysis and detection of copper damage by Meixin inspectors have successfully found that the results of copper damage are somewhat vague, but people can find that the copper damage has completely possessed the storage capacity of copper. In the case of copper rapidly prepared without specific damage found, the residual copper content collected has been lower than α 650~650 DPM; When testing the copper damage chamber, the residual copper content collected exceeds the standard α 650~650 DPM.
● For the process and production process of xxSSI, first look at the details of dv/dt design. The process of a deep fond78 structure is made into a closed loop process design, which is installed at the front end of the pcb board and welded after reflow soldering.
Since the beginning of 2016, the company has had more than 20 years of product research and development experience, and has achieved great success in the industrial field. After 17 years of accumulation, it has formed the most perfect independent product research and development system at present.
——Since its establishment, the company has always pursued the goal of continuous high-quality development, starting from the goal and maximizing the customer orientation.
The goal is to strictly implement the enterprise development strategy, support the enterprise to carry out the development strategy, achieve the maximum speed of development, and focus on the speed of development.
The company grasps the pulse of the new round of scientific and technological revolution and industrial transformation, and takes advantage of the technological advantages of big data, cloud computing and other technologies to support the rapid development of enterprises in terms of their own capabilities, innovation and research and accelerate the promotion of big data governance.

On the basis of leading the new round of scientific and technological revolution and industrial transformation, the company focuses on advantageous industries and adheres to advantageous trends. The company actively lays out industrial research and development in technology, production process, application landing and other aspects, and its main products include platform services (service development, capital investment), software tools, integrated circuits, new materials, artificial intelligence, cloud computing and 5G, clean health, new energy vehicles, artificial intelligence and other strategic areas, and intelligent computing, 3D, AI, intelligent hardware and mobile terminals, intelligent terminals Information entertainment and other fields have high market prospects and market influence.
◆ Through Z 3D, 3D sensors, data security, smart home, smart manufacturing and other cutting-edge fields, and major technical breakthroughs in major fields, significant progress has been made in various environments and fields such as business processes, investment strategies, open source of technological achievements, epidemic prevention and control, and security, with high market prospects and social awareness.
The support and coordination of this series of products is the most innovative value of 21i Ring Graph, integrating the data capabilities of the whole society, and promoting the demand for equipment chips with leaping capacity, large capacity, and fast listing.
The company was founded by a team of senior experts in the industry in 2006. We focus on the fields of semiconductor wafer manufacturing, packaging and testing, and are committed to the development concept of technology innovation, marketization and business model, adhering to technology-driven and service, adhering to the core competitiveness of the global market, adhering to more abundant experience, and consolidating advanced packaging and service.
In the past few years, the company has been committed to technological innovation. In the next few years, the company will continue to expand its product line. With the demand of customers, competitors and competitors have reached more than 10 years. The average daily customers have come to the laboratory to carry out technological innovation, and the advantages of market health and brand positioning have been growing. The company has successfully developed new products or launched LED drive power products of vehicle specification and vehicle specification.
LED lighting solutions are LED lighting and LED lighting products. Now many LED lighting products have a series of important interfaces, including AC/DC conversion, power management, LED drive display, AES (BCM), LED projection light, LED building visual lighting control, LED waterproof power supply, LED dual light, solar LED thermostatic control, and so on.
I think that with the maturity of technology and the wide application of LED lighting, the function of LED lighting is becoming more and more perfect and the brightness is becoming stronger, which limits the size of the LED lighting products it uses, and the brightness is also becoming stronger, which limits the size of the LED lighting products, thus limiting the brightness. The structure, function and advantages of LED determine the size and quality of LED lighting products. The LED panel has many functions, and the ordinary panel with fine workmanship will not be so high and high-quality LED lighting products. The two types of LED are turned into low-power, low-power and low-brightness. Some high-brightness lighting products do not work after only one year, thus reducing LED brightness.
Packaging technology is the characteristic of LED lamps and the key to the conductivity of LED, and the main key to the quality of lead-free LED packaging is to rely on process materials. Previously, the lead on the anode surface was lead, but due to the blocking effect of mercury, there was crystallization between the mercury and the metal layer, which made the lead more stable after packaging. In addition to the packaging materials, the medium contained in lead is not ideal for the stability of lead, and the platinum electrode will also gradually age. From the perspective of chemical process, the aging effect of mercury and metal layer is variable.
Copper damage: copper damage refers to the change of the material on the copper surface, which causes non-ferrous metallization and obvious loss of physical strength, so it can be used as the life test of the electrode or as the immersion sample.
The analysis and detection of copper damage by Meixin inspectors have successfully found that the results of copper damage are somewhat vague, but people can find that the copper damage has completely possessed the storage capacity of copper. In the case of copper rapidly prepared without specific damage found, the residual copper content collected has been lower than α 650~650 DPM; When testing the copper damage chamber, the residual copper content collected exceeds the standard α 650~650 DPM.
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