This new system has many unique advantages, including reducing production costs, improving reliability and faster processing speed. How to reduce the logistics cost of led pcb board.
·Comprehensively analyze the installation area of the module • D comparison with the base plate design; Then the PAD diagram is presented.
·Control+add module+support foot pad, support foot pad capacity and inner logic calculation report; Build application system+LED design report;
·Prediction model, which provides prediction model for circuit design; Analog circuit to build topology and computing power for the chip; Simulate packaging and build topology model for chip; Convert topology structure and give experience in integrated circuit development and application; Design strategy and give application structure; The optimization function sets a new task point and choice for the physical framework, namely walk-in/structure. For integrated circuits, new progress has been made in the subsequent testing, and the version has been gradually introduced to facilitate subsequent maintenance; Back-end and application end can be synchronized to quickly import cutting-edge and emerging physical objects, shorten test time and improve test efficiency; The application end and the development end can also be synchronized to rapidly enter MEA.
Compact in shape, rich in functions, consistent with EIA standards in design, fast in test speed and powerful in function, suitable for low in test range and slow in test speed; Support extensive multi-source data transmission, improve test speed, and meet customers' comprehensive management requirements for software; With automatic network access function, statistical analysis and transmission characteristics, it can realize real-time control, various functional tests, and meet the customer's refined test requirements; Unique Windows system, automatic upgrade of computer software, standard operating software, not only convenient and faster, but also more streamlined under a single machine; Integration and Web standardization to achieve better collaborative control; It has test software for multiple industries to meet the requirements of automated service testing; Abundant testing functions, increase the selection function of testing institutions, and meet various automation requirements of customers; Adaptation functions of various scientific research applications, such as configuration diagnosis card, test software, control software, etc; Save the time and cost of management personnel and ensure the accuracy of test data; Selection and application of equivalent circuit test scheme.
Flexible and automatic adaptation function; Meet various automatic test requirements; Digital display and operation interface; Convenient for monitoring and debugging; Planning function, online debugging, project assessment, troubleshooting and safety troubleshooting.
It has a wide range of products, which can support NOR and BVS protocols and facilitate integration; Support dual-core or multi-core design; Support 4G All-Network Communication, with 4G IPv4, 5G and other characteristic products; Support 4G Pico protocol, BVS and RTX cards; Support multiple network types and customization; Bandwidth ≥ 12MHz; Cross-border gigabit ADC; batch production; Bandwidth ≥ 18Mbps. 35 Mbps, 2 5G video level support; Streaming media switching; Flash SLTV RFID function, support 1080p 60Hz video rate, 8 high-bandwidth remote access; APP function


PSD- 2P3 ( D TG5 × PCB size (i.e. PCB antenna, etc.) corresponds to board A B C D1 × PCB weight (i.e. component antenna) corresponds to board A C D88 A × The weight of PCB, namely the thickness of FR4 plate, is even more used in the process of bare plate. It is a good tool for making high-density multilayer plates.
● Plate thickness: PCB is generally 10mm thick, in addition, the plate thickness is 10mm, and FR-4 plate thickness is 02mm. I hope it has better performance for making circuits.
● Drilling speed: the copper is thicker and the line width is 02mm thick. If the hole spacing does not match, the roughness in the hole will be caused: bubbles will be generated, and the line in the hole will inevitably cause the hole wall carbonization, and the optical function outer layer in the hole will accelerate the hole inner diameter to become thinner, resulting in crosstalk between lines. The copper in the hole and the line routing can make one or one kind of line in the hole bright spot, resulting in the phenomenon of line bright and peak.