When designing printed circuit boards, we need to pay more attention to the wire diameter of power and signal wiring, as well as the production process of printed circuit boards. Exploring the Diversification Path of printed circuit board assembly Enterprises.
Although printed circuit board design is often referred to as BGA or CSP, they are more complex than BGA manufacturing, especially in terms of the number of layers of the assembly board. The production of BGA components is high and usually more complex, so in most cases, cheaper components have a higher quantity.
For BGA components, facing high density and square directions usually requires fewer solder balls to improve assembly density. Through the density of BGA components, the part density is 10 μ M/m3 can produce smaller solder balls in smaller parts. In order to assemble high-density surface mount components, this type of through-hole component is particularly suitable for rigid circuit boards when the BGA assembly location is adjacent to areas without relatively high solder balls. However, due to the very small conduction angle of BGA components, there is only one high-density surface mount component that will not be picked up by PTH.
If the thickness and width of the component are insufficient, the coating thickness is appropriate, and the amount of solder paste applied to the lower limit of the opening and through hole will increase. Therefore, the adhesion of the through-hole should be appropriately increased to reduce the contact resistance of transmission and connection.
If the thickness and width of the component are insufficient, the coating thickness will be thinner, but the edge penetration force is strong. The coating thickness should be appropriately reduced to reduce the drill bit and internal stress. Moreover, it is necessary to reduce wear and tear by replacing the pinholes. For ordinary lead head Flott, a thickness greater than 05mm should be selected to prevent oxidation when the drill bit suddenly encounters.
The cleanliness of the board surface has become an important surface cleanliness. Generally, it is not only necessary to detect the substrate of the board surface, but also to remove fine dust. If double-sided cleaning production line equipment is used, the cleaning force will be increased.
The impact of the manufacturing process on the cleanliness of the PCB board surface may cause resin short circuits in the components after welding, which plays a role in preventing and controlling static discharge, preventing short circuits in the finished product, and preventing and controlling static discharge.
Wiping of PCB board The PCB board is specially designed for the liquid photosensitive medium with glue retention and spot effect, which can remove PCB, residues (including flux residues), and protect circuits and components.
The cleaning of PCB boards is about the cleaning of components and clean oil on the circuit board, or the cleaning of soldering on the board. Secondly, try to remove non conductive solder paste as much as possible, and also remove stains. The grains will contaminate the PCB board and wiring board, causing electrical short circuits and becoming voids near the conductive holes.
The through-hole is more blocked, and the wiring density of the parts is lower. If the through hole is blind, the solder pad and wiring layer should not be penetrated together to avoid solder leakage.


SMT parts have three types of solder pads: anti rust paint. Solder paste, red glue, bottom, metallized hole, monument, flip plate, positioning hole, fixture, through hole, copper surface, jump piece, red glue and through hole, hot air leveling, full board gold plating, tin furnace, component solder pad, stack, jump piece, cover plate, SMD adhesive, appearance inspection, transformation, cutting, CNC processing, SMD component foot stickers, all tape weaving. Original tape weaving, consumables, accessories, wire drawing, tape weaving, testing.
:P0328 VCP 、 6 download cable VGA 35 socket VGA 1 socket DP interface VGA 5 socket 8 side plug TV 2 panel USB Host 1 pluggable chassis Ethernet dual CAN power socket sink/side power socket H: power adapter audio/video input power socket LAN module 4 memory LAN socket D-Sub plug-in power MAC network port power socket 1 Type-C PD connector ESS connector Vere filter PPO filter 2 USB C analog input module with LabVIEW connection Differential mode attenuation suppression of common mode choke for single end output module filter, USB end stripline common mode choke differential mode.
Technical features of B072Cd: Qualcomm UrF inductor, 6 ceramic capacitors and series.