The next step in the rigid-flex board industry is to break through bottlenecks and move towards excellence!
The commonly used width of Teflon film FPC flexible circuit board industry is rigid. The next step in the flexible board industry is to break through the bottleneck and move towards excellence! The commonly used widths in the PTFE film FPC flexible circuit board industry are. On the basis of 2016, the FPC flexible circuit board industry has expanded its application scope to fields such as automotive electronics, medical devices, connectors, industrial automation, etc., such as FPC soft boards, automotive, aerospace, ITO conductive films, connectors, etc.
The characteristic of FPC flexible circuit board is made of flexible insulation substrate, which can be bent because it is very thin. Its physical form is a combination of bending, lightness, compression, flame retardancy, and flexibility.
FPC flexible board is a kind of insulating circuit substrate with high elasticity, high reliability, heat resistance, flexibility and flexibility, which is made of polyimide or polyester film as the substrate.
LCP soft hard bonding board is a new type of hot pressing bonding process that combines hard and soft boards. There are currently two main types of hot pressing bonding processes for LCP soft and hard bonding plates, namely high conductivity copper and buried copper. The excellent characteristics of the product make it widely applicable to flexible circuit boards, flexible circuit boards, and soft hard combination boards.
In the automotive field, both soft boards and soft hard combination boards are included in typical application areas, while heavy-duty hard boards and soft circuit boards, due to their advantages in the automotive field, must undergo strict soft hard combination testing for soft boards and soft hard combination boards.
Take the car module as an example. Therefore, the AOI (Automatic Optical Inspection) function will obtain more accurate images, enabling the implementation of more complex algorithms, making the manufacturing of cars more conducive to the manufacturing of micro cars. AOI can also automatically perform algorithms (3D Spa) and virtual reality (VR IMAX) on the occupants of the vehicle using image acquisition technology. AOI can not only be used for servo acquisition, but also in fields such as tire pressure monitoring, intelligent manufacturing, and industrial design. Can AOI achieve a motion free mobile camera control solution for components through high-speed edge and image acquisition? At present, it has also helped solve hardware problems on the hardware platform. AOI can achieve machine learning processing and complex mechanical motion control in software and hardware. In complex scenarios, this algorithm is very suitable for a more complex problem. Similarly, there are many software development services for hardware and software implementation. The hardware of these services can be self-developed and developed using various software tools to meet different model development capabilities and requirements.
The above software, hardware, and software all have the ability to implement them. Only IT departments with high reliability hardware and software can implement good software development capabilities, as long as there are problematic systems and other capabilities.


In addition, it can achieve system control for multiple on-site calls of various software in the factory, and also solve the need for MES system control before completing business, as well as the management of production volume and effective control of its process.
The characteristic of FPC flexible circuit board is made of flexible insulation substrate, which can be bent because it is very thin. Its physical form is a combination of bending, lightness, compression, flame retardancy, and flexibility.
FPC flexible board is a kind of insulating circuit substrate with high elasticity, high reliability, heat resistance, flexibility and flexibility, which is made of polyimide or polyester film as the substrate.
LCP soft hard bonding board is a new type of hot pressing bonding process that combines hard and soft boards. There are currently two main types of hot pressing bonding processes for LCP soft and hard bonding plates, namely high conductivity copper and buried copper. The excellent characteristics of the product make it widely applicable to flexible circuit boards, flexible circuit boards, and soft hard combination boards.
In the automotive field, both soft boards and soft hard combination boards are included in typical application areas, while heavy-duty hard boards and soft circuit boards, due to their advantages in the automotive field, must undergo strict soft hard combination testing for soft boards and soft hard combination boards.
Take the car module as an example. Therefore, the AOI (Automatic Optical Inspection) function will obtain more accurate images, enabling the implementation of more complex algorithms, making the manufacturing of cars more conducive to the manufacturing of micro cars. AOI can also automatically perform algorithms (3D Spa) and virtual reality (VR IMAX) on the occupants of the vehicle using image acquisition technology. AOI can not only be used for servo acquisition, but also in fields such as tire pressure monitoring, intelligent manufacturing, and industrial design. Can AOI achieve a motion free mobile camera control solution for components through high-speed edge and image acquisition? At present, it has also helped solve hardware problems on the hardware platform. AOI can achieve machine learning processing and complex mechanical motion control in software and hardware. In complex scenarios, this algorithm is very suitable for a more complex problem. Similarly, there are many software development services for hardware and software implementation. The hardware of these services can be self-developed and developed using various software tools to meet different model development capabilities and requirements.
The above software, hardware, and software all have the ability to implement them. Only IT departments with high reliability hardware and software can implement good software development capabilities, as long as there are problematic systems and other capabilities.


In addition, it can achieve system control for multiple on-site calls of various software in the factory, and also solve the need for MES system control before completing business, as well as the management of production volume and effective control of its process.
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