Driven by the development trend of informatization and digitization, the PCB industry has broad market space and good development prospects. rigid-flex board products have good application prospects. FPC flexible circuit board is a flexible circuit board used for lithium-ion batteries based on flexible insulating material sheets. The substrate material of the circuit board is polyimide or polymer PI.
The company positioning of FPC flexible circuit boards is very important, and here are the issues we need to pay attention to.
Generally, regardless of the type of board used by FPC flexible circuit board manufacturers, their production line will perform about 50% compression, because 100% can only produce one FPC flexible circuit board. If ordinary boards such as FR-4 are used, about 50% compression can be done, and if ordinary boards such as FR-4 are used, about 50% compression can be done.

The lamination of FPC flexible FPCB is often a single-layer board, which requires multi-layer boards. That is to say, as long as a single layer board is made, only two layers of boards need to be pressed on top.
Only when the number of layers is a single sided mixed board, the overall field of view scale requires high electrical performance requirements for printed circuit boards.
The positions of each component correspond to the inner circuit and the positions installed on both sides of the outer circuit board. In order to ensure the electrical performance of the double-sided board, the position of the components needs to be designed with drilling holes, and the pins and pads of the components can be drilled on it.
The graphics of the inner circuit are the inner circuit, which uses projection exposure, development, SEM film removal, and other methods to create photosensitive graphics. The graphics are taken with a digital camera and bonded with adhesive mesh for exposure and development. Generally, the graphics layer is not allowed to be used as the inner circuit. The graphics of the inner circuit are the outer circuit, and the inner circuit graphics are made by electroplating nickel or tin. The graphics of the inner circuit are the graphics of the outer circuit, which are manufactured using the lamination method. If sandblasting is used for annealing, the process flow is shown in the following figure.
For copper surfaces, their impact cannot be detected in a timely manner during manual inspection. The disadvantage is that there is no qualified tolerance during inspection. The result of the inspection is that the allowable error during the inspection process is small, and no more than 5 are allowed after the inspection.
The testing of PCB circuit boards is mainly a preliminary review conducted manually, testing all test points to confirm whether the functions of the circuit board meet the requirements. By inspecting the appearance and function of the product, potential defects can be identified in a timely manner, and the severity of the problem can be determined based on its normal service life, whether it has been discovered, and the cause of the abnormality.
The design requirements of board information for most PCB boards must be the most reasonable to meet the reliability requirements required by users. The design requirements of PCB boards are equivalent to confirming the function of PCB design and the specific material design requirements for material selection.

Many PCB designers have adopted technologies that exceed the IPC standards in order to achieve their desired goals, and it is foreseeable that PCB boards will be the ultimate platform for using these technologies. However, the most common issue is how to ensure that the functions on the PCB board do not fail, and to avoid design failure issues such as circuit boards.