So, is the SMT processing fee for flexible circuit boards a standard for testing FPC manufacturers? MT processing: Customs fee standards for printed circuit board assembly.

The SMT processing fee standard for flexible circuit boards. Generally, after the finished product is processed and shipped, bare boards are used. However, for bare board design and small batch production, the board making fee is generally calculated based on the startup fee.
A certain fee will be charged for the chip processing fee and program, with startup fee=startup fee+invoice fee+engineering fee.
Each circuit board of the B circuit board should be designed with allowable cycles (designed according to the requirements), and there should be some relationship between the lengths of each wiring. For example, the starting length is 5 meters per wiring requirement, and in many cases, it is required to be 5mm; If running on a large area, the line width must meet the above requirements, and the length of each line should not be too long.
However, due to design issues, after passing appropriate wave soldering tests on each component, repeated testing is still necessary to achieve good quality.
During testing, it should be avoided as much as possible, as the test circuit board may be stored for too long and cause leakage. Due to the long length of the test line, the expected electrical performance cannot be achieved. In addition, the resistance of the test line and other parts within the instrument varies due to their different lengths. In addition, the impact of high temperature and humidity on the testing circuit board can cause some errors, which can lead to testing errors.
The testing instrument should be placed in a dry area and the surrounding temperature should be adjusted to the highest level so that it can pass through.
Due to the current skin effect of twisted pair, it is easy to generate induced voltage between two cores, especially under the interference of electromagnetic field, such instruments often generate induced voltage fluctuations of about 10G.
The following figure is a typical testing principle, where the spacing between metal strips is greater than 10mm, the length is less than 10mm, and the length of the two strips is only 2 μ M pure copper coil, with a maximum length of 100mm and a diameter of ≥ 2 μ M's pure copper coil.
If two induced voltage signals are connected with the same waveform, measure 30-300 μ m、100-400 μ The resolution of m is 1 μ The height and width of m are consistent in measurement accuracy and resolution.

The adjustment of technical indicators ensures the accuracy of the capacitor in terms of environmental temperature (including three cycles, two cycles, and three cycles in phase), initial state (to be tested repeatedly), and resolution of performance test results.
For extremely thin capacitors and small splash tubes, the best protective measures can effectively minimize the presence of extremely fine particles from the outside; For non-metallic condensed water, it can be avoided from remaining on the plastic surface.
Ultra fine aperture ball grid array (B-PTGA) is most suitable for high-density printed circuit boards. For example, carbon fiber relief printed circuit boards have H/mother lens chips on them, which can be packaged using D-PTGA. In addition, there is vacuum evaporation gold plating, which are transparent isolation strips between thin-walled or thick walled steel plates.