Xi'an Xima Electric Machinery closely follows the development trend of the motor industry, understands the dynamics of the motor market, and formulates a development plan for Xima Electric Machinery. The potential for the rigid-flex board industry to achieve leapfrog development through the market is considerable.
Design of functional components (K double-sided printed circuit board), plug-in board, electromechanical design of bare board (Device), dedicated framework design (), and Shangqiu circuit board design (amper).
After the trial production of finished products is completed, follow and monitor project performance (DFA/FA). But in order to ensure yield and yield, we will increase performance when productivity (DFA/FA) allows. By summarizing, even if the last result is not available, we can easily modify manufacturing parameters on the production line and utilize FA and acceptable indicators that have been achieved. By analyzing a large amount of data, it is expected that its impact on the actual attributes of the target is not significant, and its impact on most attributes is also very significant. This can also help improve the modeling performance of feature attributes without the need for a deep understanding of their main attributes.
Compare the source current method observation method with feature testing to determine more complex and lower energy consuming conductive and alloy conductors. Through a series of tests, more complex non-conductive conductors and their thermal resistance between them were discovered.
Used to simulate the changes in electrical amplitude, short-circuit current, and resistance of cables under 10 V voltage, and transmit the measured values to the next parameter.
A 00 and G 00 are connected in series. According to different test levels, the resistance changes rapidly.
Branch connection between C 00 and G 00. The capacitance between the wire and the grounding wire changes rapidly.
The capacitance change between E 08 and G 08. At 5 μ F and 15 μ Between F, G and G can be considered to differ by more than 5 μ F。

In addition to capacitance changes, capacitance changes can cause voltage offset. This is a broad concept, but it also provides some aspects that need to be noted. It includes the crucial switching slope of a dielectric switching capacitor. This advantage is an example of preventing circuit switch testing in the event of a power outage.
Connect the power cord from the sensor to the E-type (voltage probe). These are lower voltage adjustments that cannot provide true power transmission. On an E-type test circuit, due to the simplified design of the circuit, the same internal resistor is used, but the required power is usually "1500 watts". Measure a voltage using the previous two resistors, where the power of Vcc is its DC voltage value, and then calculate "E".
This method only needs to consider a single resistor to obtain the IC to complete this test, and only a small amount of inductance is required to achieve this. For most chips, due to their high operating current, a longer resistor connection is required. If this test is to be conducted, it will take more time.