I believe it will bring new surprises to more industries in the future. A new situation has emerged in the rigid flexible board industry.
In some specific fields, such as consumer electronics, automotive electronics, industrial electronics, etc., traditional heat treatment methods can be used to metallize thin or fiber substrates, and metallized hole electroplating technology can be directly applied to metallized holes.
And thinner metallized holes were obtained, resulting in a reduction in the structural size of the metallized holes and a smaller circuit size. In addition, through the alloying process, the size of the metallized hole is reduced, resulting in a thinner circuit size.
In order to reduce blind holes on flexible circuit boards, a unique metallized hole was designed, resulting in a smaller blind hole size.
● In order to save design process and mainly reduce large hole diameter, metallized hole diameter and plate thickness, Phosphor bronze metallized hole without drill bit can be used as far as possible. If thinner copper foil hole is selected, the hole diameter is greater than or equal to 0 μ Inch/0 μ The hole size for in will be chosen separately.

Select double-sided copper foil with a smaller thickness. For dense feet or without double-sided copper foil holes, thinner copper foil with drilled holes can be used. However, for printed circuit boards with buried blind hole structures that require buried holes or PCBs with buried blind holes, thicker copper foil with drilled holes should be selected to reduce the generation of through holes.
The minimum aperture of the double panel should be less than 02mm, the minimum line width should be less than 01mm, and the minimum line spacing should be greater than 03mm.
The components of the high-frequency circuit should be as close as possible to the heating element, and the connection with the top layer should be as small as possible to effectively prevent the temperature rise of the heating element.
For the chassis with the PCBBCC base as the core, it should be tightly attached to the PCBC line to enable the chassis to dissipate heat more effectively.
PCB holder (When installing the chassis, it should be arranged in reasonable zones according to the size of the chassis, and the arrangement should meet the principles of compact structure.).
The spacing between ECB boards should not be kept away from AC when there is a coupling capacitor, in order to avoid high-frequency interference of the power coupling capacitor on the AC board.
● Material: Connect the B and C wires to the VCC and GND of the PCB and solder chip respectively, and it is required to connect to the VCC and GND of the PCB.